Newsletter

In the era of Advanced Packaging (e.g., CoWoS, Chiplet), heterogeneous integration introduces complex material interfaces. Consequently, thermal stress and warpage have made Delamination a primary yield killer.

Micro bumps are critical miniature solder interconnects used in advanced packaging technologies. Their size is typically below 40 μm, and can even shrink to 10–20 μm, which is significantly smaller than traditional BGA (diameter > 500 μm) or flip chip bumps (diameter ~80–120 μm). They are used to enable high-density interconnections between die-to-die or die-to-interposer.

Failure modes in advanced packaging are concentrating around invisible defects. These are not issues you can identify with surface checks. In many cases, only X-ray inspection can reveal internal bonding integrity without damaging the sample.

As advanced packaging moves toward high I/O density and heterogeneous integration, icro bumps have become a key technology for high-density chip-to-chip interconnects. They offer smaller sizes and higher I/O density compared to traditional solder balls, and are widely used in 2.5D, 3D IC, Chiplet, and high-frequency/high-speed component packaging.

In the era of Advanced Packaging (e.g., CoWoS, Chiplet), heterogeneous integration introduces complex material interfaces. Consequently, thermal stress and warpage have made Delamination a primary yield killer.