Newsletter

The semiconductor industry is undergoing a profound transformation as devices demand higher performance, smaller form factors, and lower power consumption. Traditional packaging approaches are no longer sufficient to meet the requirements of AI accelerators, high-performance computing (HPC), 5G communication, autonomous vehicles, and consumer electronics, all of which rely heavily on advanced packaging technologies to enable higher bandwidth, greater interconnect density, and improved thermal management.

Wafer warpage is a critical challenge in advanced semiconductor processes, particularly with thin wafers, heterogeneous integration. Warpage can lead to misalignment, transfer failures, and significant yield loss. To tackle these challenges, Scientech together with AMC has developed an integrated solution tailored to modern manufacturing demands.

The evolution of semiconductor technologies into sub-10 nm nodes and 3D architectures like high-bandwidth memory (HBM), even small static potentials can result in critical device failures. The effectiveness of DC ionization compared to AC systems, especially for protecting advanced packaging structures such as micro-bumps and TSVs. As semiconductor processes scale down and packaging grows more complex, controlling ESD during wet cleaning and drying becomes essential.

In semiconductor manufacturing, dicing or singulation is a critical process that separates individual dies from a processed wafer. Whether performed mechanically or with lasers, this step introduces significant physical stress on the wafer, which may lead to chipping or cracking of the silicon (Si) substrate.