Current
Timeline
2024
- Awarded as a 7th Mid-Sized Enterprise with High Potential
- ISO 9001:2015 certified – Taipei, Hsinchu, and Hukou sites
- ISO 14001:2015 and ISO 45001:2018 certified – Hukou site
- ISO 22301:2019 compliance audit passed – Hsinchu and Hukou sites
- ISO 27001:2022 compliance audit passed – Hsinchu and Hukou sites
- Bronze Medal – Talent Development Quality Management System (Enterprise Edition)
- ISO 50001:2018 certified – Hukou site
2023
- Certified by Dun & Bradstreet (D-U-N-S® Registered™)
- ISO 9001:2015 certified – Taipei, Hsinchu, and Hukou sites
- ISO 14001:2015 and ISO 45001:2018 certified – Hukou site
- Recipient of the Ministry of Economic Affairs' Industrial Upgrade and Innovation Program Subsidy (Thematic R&D Project)
2022
- Certified by Dun & Bradstreet (D-U-N-S® Registered™)
- ISO 9001:2015 audited – Taipei, Hsinchu, and Hukou sites
- ISO 14001:2015 and ISO 45001:2018 certified – Hukou site
- Passed TIPS-AA 2016 certification
- ISO 22301:2019 certified – Hsinchu and Hukou sites
- ISO 27001:2022 certified – Hsinchu and Hukou sites
2021
- Recognized with the "Health Promotion Mark" through participation in the Healthy Workplace Certification
- Certified by Dun & Bradstreet (D-U-N-S® Registered™)
- ISO 9001:2015 certified – Taipei, Hsinchu, and Hukou sites
- ISO 14001:2015 and ISO 45001:2018 certified – Hukou site
- ISO 22301:2019 certified – Hsinchu and Hukou sites
- Directly approved through documentation review for TIPS-AA 2016 certification
- ISO 27001:2013 certified – Hsinchu and Hukou sites
2020~2016
- 2020 – Invested in TRANSCEND CAPITAL CORP and further invested in XTek-Semicon, expanding into China's wafer reclamation industry
- 2019 – Certified with Taiwan Intellectual Property Management System (TIPS) – AA level, 2016 edition
- 2018 – Participated in the Healthy Workplace Certification and received the "Health Promotion Mark"
- 2017 – Certified under the 2016 edition of the Taiwan Intellectual Property Management System (TIPS)
- 2016 – Successfully developed 300mm glass carrier wafer debonding equipment
- 2016 – Certified under the 2007 edition of the Taiwan Intellectual Property Management System (TIPS)
2015~2011
- 2015 – Successfully developed SiC wafer reclamation process technology
- 2015 – 12-inch Glass Coater (Spin Coater) obtained SEMI S2 certification
- 2014 – Successfully developed 8" & 12" single-wafer wet etching and cleaning equipment, and 300mm glass carrier wafer reclamation process
- 2014 – Received the "Outstanding Healthy Workplace" certification and "Dynamic Vitality Award" from the Health Promotion Administration
- 2013 – Publicly listed on the stock exchange on March 12
- 2012 – Registered on the Emerging Stock Market on April 23
- 2011 – Merged with Scientech Wafer Technology Co., Ltd.
2010~2001
- 2009 – Successfully secured domestic semiconductor customer orders and produced 12" self-developed equipment
- 2006 – Invested in Scientech Wafer Technology Co., Ltd., entering the wafer reclamation industry
- 2005 – Invested in SCIENTECH (Shanghai) Trading Co., Ltd. and SCIENTECH ENGINEERING USA CORP
- 2004 – Established Hukou factory, expanding into R&D, production, and sales of semiconductor and optoelectronic process equipment
- 2003 – Hsinchu plant and office building completed and operational
- 2001 – Taipei Neihu office opened
2000~1980
- 1999 – Established the Tainan office to provide localized support for customers in southern Taiwan.
- 1990 – Established the Hsinchu office to serve customers in the Hsinchu Science Park.
