Batch Panel-level Wet Process Equipment-WSE Panel Series

As semiconductor packaging evolves toward panel-level packaging. Scientech, leveraging its expertise in in-house batch wet process equipment, has successfully developed panel-level batch wet process equipment to meet market demand, applied in panel-level packaging processes. WSE-panel is an advanced and cost-effective panel-level batch wet process system solution, capable of processing multiple panels in a single batch and equipped with multiple tanks suitable for various chemicals.

• Customization for hardware and software
• Excellent particle removal performance
• Leading-edge technologies
• Customization for panel sizes

The panel-level packaging equipment series’ batch panel-level wet process equipment can be applied in
panel-level advanced packaging, including:

• Fan-out panel-level packaging (FOPLP)
• Chip on Panel on Substrate
• FoCoS (Fan Out Chip on Substrate)
• PiFO (Pillar integration FO)

The applicable processes are as follows:

• Stripper: PR/PI strip, Polymer remove
• Metal Etch
• Wafer reclaim