Single Panel-level Wet Process Equipment-Polar Panel Series

As semiconductor packaging evolves toward panel-level packaging. Scientech, leveraging its expertise in in-house single-wafer wet process equipment, has successfully developed the Polar-panel single-panel wet process equipment to meet market demand, applied in panel-level packaging wet processes.

• Customization for hardware and software
• Excellent particle removal performance
• Outstanding etching uniformity
• Leading-edge technologies
• Customization for panel sizes

The panel-level packaging equipment series’ single-panel wet process equipment can be applied in
panel-level advanced packaging, including:

• Fan-out panel-level packaging (FOPLP)
• Chip on Panel on Substrate
• FoCoS (Fan Out Chip on Substrate)
• PiFO (Pillar integration FO)

The applicable processes are as follows:

• Stripper : PR strip
• UBM Etch
• Metal Etch