Single Wafer Wet Process Equipment-Polar Series

The Polar series is a single-wafer surface treatment system that leverages FEoL research findings and accumulated expertise in related fields. This system offers exceptional performance and scalability for advanced clean and etch processes, with high throughput and a compact footprint. With industry-recognized reliability and productivity, the company continues to evolve its technology to meet customer requirements and create new advanced cleaning solutions, making it a leading domestic single-wafer wet equipment provider.

• Customized hardware and software
• Industry-leading chemical recycle rate
• Transfer solution for high-warpage wafers
• Multi-layer metal etch capability in the same chamber
• Excellent etch rate and uniformity

Polar series single-wafer wet process equipment can be applied in the following fields:

• Semiconductor FEoL (Front-End-of-Line)
• Semiconductor advanced packaging process
• Compound semiconductor processes (SiC / GaN / GaAs / InP / …)
• MEMS (Micro-Electro-Mechanical Systems)
• LED / Mini LED / Micro LED

The application process is as follows:

• PR Strip
• Wafer Clean (APC, Soft spray, Mega sonic)
• UBM Etch / Metal Etch
• Flux Clean (Hot DIW)
• Final Clean (Dual-side, Mega sonic)
• Mask Clean
• Frame Clean
• Spin Etch with Immersion Function