Single Panel-level Release Layer Coating Equipment-Pyxis Panel Series

As semiconductor packaging evolves toward panel-level packaging. Scientech, leveraging its expertise in in-house single-wafer release layer coating equipment, has successfully developed the Pyxis-panel single-panel release layer coating system to meet market demand, applied in panel-level packaging release layer coating processes.

• Outstanding release layer uniformity
• High-efficiency production equipment
• Leading-edge technologies
• Customization for panel sizes

The panel-level packaging equipment series’ single-panel release layer coating equipment can be applied in panel-level advanced packaging, including:

• Fan-out panel-level packaging (FOPLP)
• Chip on Panel on Substrate
• FoCoS (Fan Out Chip on Substrate)
• PiFO (Pillar integration FO)

Its primary applicable process is:

• Releasing layer coating