Scientech Products

Vertabake is the most advanced and cost-effective wafer batch baking solution. It can process one batch of wafers (25 wafers) per bake, with the option to bake the batch vertically or horizontally. It is applied in pre-molding baking and pre-underfill baking processes in advanced packaging.

• Batch baking: can process one batch (25 wafers) at a time.
• Batch can be baked vertically or horizontally.
• Transfer: The wafer cassette clamp features a tilt-angle design, ensuring that wafers do not fall or collide with the cassette holder during handling.

The Vertabake series advanced baking equipment is suitable for advanced semiconductor packaging.
Its applicable process is:

• Pre-molding baking
• Pre-underfill baking

As semiconductor packaging evolves toward panel-level packaging. Scientech, leveraging its expertise in in-house batch wet process equipment, has successfully developed panel-level batch wet process equipment to meet market demand, applied in panel-level packaging processes. WSE-panel is an advanced and cost-effective panel-level batch wet process system solution, capable of processing multiple panels in a single batch and equipped with multiple tanks suitable for various chemicals.

• Customization for hardware and software
• Excellent particle removal performance
• Leading-edge technologies
• Customization for panel sizes

The panel-level packaging equipment series’ batch panel-level wet process equipment can be applied in
panel-level advanced packaging, including:

• Fan-out panel-level packaging (FOPLP)
• Chip on Panel on Substrate
• FoCoS (Fan Out Chip on Substrate)
• PiFO (Pillar integration FO)

The applicable processes are as follows:

• Stripper: PR/PI strip, Polymer remove
• Metal Etch
• Wafer reclaim
   

Leveraging its professional in-house equipment development capabilities in the semiconductor field, Scientech has developed the Pyxis series Debonding and Cleaning Equipment, providing solutions for glass and wafer cleaning after debonding in semiconductor wafer thinning processes and advanced packaging processes.

• Customized design for hardware and software.
• High-efficiency production equipment

The Pyxis series debonding clean equipment can be applied in:

• Semiconductor wafer thinning
• BGBM (Backside Grinding & Backside Metallization)
• Compound semiconductor wafer thinning (SiC/GaN)
• Advanced semiconductor packaging

Its applicable process is:

• Glass cleaning

Scientech, in collaboration with international leader 3M, has developed the Pyxis series Debonding Equipment, including Frame Debonding Equipment and Taiko Debonding Equipment, providing solutions for glass debonding processes in wafer thinning and BGBM (Backside Grinding & Backside Metallization).

• High-efficiency production equipment
• Lower consumables cost (Low CoO)
• No wafer cleaning required after debonding

The Pyxis series debonding equipment can be applied in:

• lSemiconductor wafer thinning
• lBGBM (Backside Grinding & Backside Metallization)
• lCompound semiconductor wafer thinning (SiC/GaN)

Its applicable process is:

• lFrame debonding
• lTaiko debonding

Scientech, in collaboration with global leader 3M, has developed the Pyxis series Glass Releasing Layer Coating Equipment which provides solutions for glass releasing layer coating in wafer thinning, BGBM (Backside Grinding & Backside Metallization), and advanced semiconductor packaging processes.

• High-efficiency production equipment
• Excellent releasing layer uniformity
• Dispense nozzle tip auto-clean function
• Cup auto-clean function

The Pyxis series glass release layer coating equipment can be applied in:

• Semiconductor advanced packaging
• Semiconductor wafer thinning
• BGBM (Backside Grinding & Backside Metallization)
• Compound semiconductor wafer thinning (SiC / GaN …)

Its applicable process is:

• Glass release layer coating

As semiconductor packaging evolves toward panel-level packaging. Scientech, leveraging its expertise in in-house single-wafer release layer coating equipment, has successfully developed the Pyxis-panel single-panel release layer coating system to meet market demand, applied in panel-level packaging release layer coating processes.

• Outstanding release layer uniformity
• High-efficiency production equipment
• Leading-edge technologies
• Customization for panel sizes

The panel-level packaging equipment series’ single-panel release layer coating equipment can be applied in panel-level advanced packaging, including:

• Fan-out panel-level packaging (FOPLP)
• Chip on Panel on Substrate
• FoCoS (Fan Out Chip on Substrate)
• PiFO (Pillar integration FO)

Its primary applicable process is:

• Releasing layer coating

As semiconductor packaging evolves toward panel-level packaging. Scientech, leveraging its expertise in in-house single-wafer wet process equipment, has successfully developed the Polar-panel single-panel wet process equipment to meet market demand, applied in panel-level packaging wet processes.

• Customization for hardware and software
• Excellent particle removal performance
• Outstanding etching uniformity
• Leading-edge technologies
• Customization for panel sizes

The panel-level packaging equipment series’ single-panel wet process equipment can be applied in
panel-level advanced packaging, including:

• Fan-out panel-level packaging (FOPLP)
• Chip on Panel on Substrate
• FoCoS (Fan Out Chip on Substrate)
• PiFO (Pillar integration FO)

The applicable processes are as follows:

• Stripper : PR strip
• UBM Etch
• Metal Etch

The Polar series is a single-wafer surface treatment system that leverages FEoL research findings and accumulated expertise in related fields. This system offers exceptional performance and scalability for advanced clean and etch processes, with high throughput and a compact footprint. With industry-recognized reliability and productivity, the company continues to evolve its technology to meet customer requirements and create new advanced cleaning solutions, making it a leading domestic single-wafer wet equipment provider.

• Customized hardware and software
• Industry-leading chemical recycle rate
• Transfer solution for high-warpage wafers
• Multi-layer metal etch capability in the same chamber
• Excellent etch rate and uniformity

Polar series single-wafer wet process equipment can be applied in the following fields:

• Semiconductor FEoL (Front-End-of-Line)
• Semiconductor advanced packaging process
• Compound semiconductor processes (SiC / GaN / GaAs / InP / …)
• MEMS (Micro-Electro-Mechanical Systems)
• LED / Mini LED / Micro LED

The application process is as follows:

• PR Strip
• Wafer Clean (APC, Soft spray, Mega sonic)
• UBM Etch / Metal Etch
• Flux Clean (Hot DIW)
• Final Clean (Dual-side, Mega sonic)
• Mask Clean
• Frame Clean
• Spin Etch with Immersion Function

Scientech, in collaboration with global leader 3M, has developed the Pyxis series Temporary Bonding Equipment, providing solutions for glass bonding processes in wafer thinning and BGBM (Backside Grinding & Backside Metallization). In addition, leveraging its professional in-house equipment development capabilities in the semiconductor field, Scientech has developed temporary bonding equipment applicable to advanced semiconductor packaging processes.

• High-efficiency production equipment
• Lower consumables cost (Low CoO)
• No wafer cleaning required after debonding

The Pyxis series temporary bonding equipment can be applied in:

• Semiconductor wafer thinning
• BGBM (Backside Grinding & Backside Metallization),
• Compound semiconductor thinning (SiC/GaN)
• Advanced semiconductor packaging

Its applicable process is:

• Temporary bonding

The WS (Wet Station) series is a state-of-the-art, cost-effective wafer processing system solution capable of processing up to 50 wafers in a batch, with multiple tanks suitable for a wide range of chemistries. It supports traditional wet processes such as pre-film clean, etch, post-etch clean, and photoresist stripping. Newly developed features enable batch processing with a smaller footprint, superior productivity, and exceptional cleaning results.

• Customized hardware and software
• Transfer options: Cassette-less, Cassette-type, or Boat-type
• Multi-functional dryer options
• Excellent particle removal
• Excellent etching uniformity

WS series batch wafer wet process equipment can be applied in the following fields:

• Semiconductor FEoL (Front-End-of-Line)
• Semiconductor advanced packaging process
• Compound semiconductor processes (SiC / GaN / GaAs / InP / …)
• MEMS (Micro-Electro-Mechanical Systems)
• LED / Mini LED / Micro LED

The application process is as follows:

• Etch: Metal, Oxide removed, Nitride removed
• Stripper: PR/PI strip, Polymer remove
• Clean: Pre-clean, Post clean, Flux clean
• Electro-less Plating: Zn/Ni/Pd/Au