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SCIENTECH

Debonding Cleaning Equipment

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Debonding Cleaning Equipment

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Leveraging its professional in-house equipment development capabilities in the semiconductor field, Scientech has developed the Pyxis series Debonding and Cleaning Equipment, providing solutions for glass and wafer cleaning after debonding in semiconductor wafer thinning processes and advanced packaging processes.

  • Customized design for hardware and software.
  • High-efficiency production equipment

The Pyxis series debonding clean equipment can be applied in:

  • Semiconductor wafer thinning
  • BGBM (Backside Grinding & Backside Metallization)
  • Compound semiconductor wafer thinning (SiC/GaN)
  • Advanced semiconductor packaging

Its applicable process is:

  • Glass cleaning

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