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辛耘公司 SCIENTECH
SCIENTECH CORPORATION
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Glass Release Layer Coating-Pyxis RL Series

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Scientech, in collaboration with global leader 3M, has developed the Pyxis series Glass Releasing Layer Coating Equipment which provides solutions for glass releasing layer coating in wafer thinning, BGBM (Backside Grinding & Backside Metallization), and advanced semiconductor packaging processes.

  • High-efficiency production equipment
  • Excellent releasing layer uniformity
  • Dispense nozzle tip auto-clean function
  • Cup auto-clean function

The Pyxis series glass release layer coating equipment can be applied in:

  • Semiconductor advanced packaging
  • Semiconductor wafer thinning
  • BGBM (Backside Grinding & Backside Metallization)
  • Compound semiconductor wafer thinning (SiC / GaN …)

Its applicable process is:

  • Glass release layer coating

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