Scientech’s wet process equipment has been successfully implemented in the fabrication of the recent chipset 3DIC, CoWoS and advanced packaging process.
Test wafers play an indispensable role in the semiconductor industry, fulfilling various functions that are vital for manufacturing, failure analysis and quality assurance of semiconductor devices. Test wafers are of paramount importance in ensuring the reliability and efficiency of semiconductor devices and technologies.
Three-dimensional integrated circuits (3DICs) have emerged as a promising solution to meet the increasing demands for high performance and compactness in modern applications. By stacking individual ICs/wafers together as a single package, 3DIC technology offers several advantages over traditional two-dimensional (2D) integrated circuits.
In modern semiconductor process, removing the photoresist is a critical step. After the lithography process, the exposed photoresist must be removed from the wafer surface to reveal the patterned areas for further processing.
Handling ultrathin wafers and reducing wafer thickness without damaging the pre-process has been a challenging task for semiconductor industries. Temporary bonding and debonding (TBDB) technology was developed to address this.
