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辛耘公司 SCIENTECH
SCIENTECH CORPORATION
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SCIL

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SCIL's technology began to take shape at Philips Research in 2001, and in 2015, Philips Research and Philips Intellectual Property & Standards decided to move the technology from "laboratory research and development" to "industrial mass production." SCIL Nanoimprint Solutions was thus born. Its first step was to design and build a fully automated machine specifically for imprinting nanopatterns onto substrates. The SCIL team gradually grew into a cross-disciplinary professional team. In 2023, SCIL Nanoimprint Solutions received funding from institutions across Europe and officially spin-out from Philips, embarking on a new path of development.

AutoSCIL

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AutoSCIL is an all-in-one system designed for laboratory research and development, process development, proof-of-concept (PoC) and pilot runs. Hardware and space design: It adopts a highly integrated enclosed chassis design, integrating all core functions such as wafer handling, pre-alignment, photoresist spin coating, capillary imprinting, and baking into a single machine space. Its small footprint makes it ideal for deployment in space-constrained R&D cleanrooms.

Features

  • Up to 700 imprints can be achieved with a single stamp, significantly reducing production costs compared to conventional technologies.
  • The proprietary resist features rapid curing without the need for additional UV exposure. Its high etching selectivity also eliminates the need for traditional hard masks (hard mask - SiO2, Si3N4, etc.), saving both process steps and costs for the production line.  
  • Direct face-to-face flat-press imprinting delivers significantly higher alignment accuracy compared to the rolling method.
  • All-in-one system with spin coating
  • Wafer cassette rack position
  • 100, 150 and 200mm wafers
  • Double side alignment  
  • Optical I/O
  • Silicon Photonics, CPO
  • CW laser/EML laser
  • Laser Polarizers
  • Face Recognition Sensors
  • Metalens
  • Waveguides

FabSCIL

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Briefly

  • FabSCIL is a high-end lithography system designed for high-volume production.
  • Breaking away from the limitations of standalone systems, it adopts an advanced cluster design. The entire system consists of multiple independent process modules connected in series, including multiple independent spin-coating modules, curing/baking modules, and a central high-efficiency robotic arm. This architecture allows customers to "freely configure and expand" the system according to production line capacity bottlenecks to achieve maximum overall equipment efficiency (OEE).

Features

  • Up to 700 imprints can be achieved with a single stamp, significantly reducing production costs compared to conventional technologies.
  • The proprietary resist features rapid curing without the need for additional UV exposure. Its high etching selectivity also eliminates the need for traditional hard masks (hard mask - SiO2, Si3N4, etc.), saving both process steps and costs for the production line.  
  • Direct face-to-face flat-press imprinting delivers significantly higher alignment accuracy compared to the rolling method.
  • Cluster design, freely configurable
  • Spincoating, curing, etc
  • Wafer cassette loading station
  • 150, 200 and 300mm wafers
  • Double side alignment 
  • Optical I/O
  • Silicon Photonics, CPO
  • CW laser/EML laser
  • Laser Polarizers
  • Face Recognition Sensors
  • Metalens
  • Waveguides

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