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辛耘公司 SCIENTECH
SCIENTECH CORPORATION
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UNISERS AG

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UNISERS, a cutting-edge semiconductor metrology and defect control startup headquartered in Zurich, Switzerland (founded in 2019 as an ETH Zurich spinoff), is dedicated to solving the most challenging nanoscale particle contamination problems in next-generation chip manufacturing. The company's flagship product, the UNISERS Explorer, is a revolutionary automated in-line 300mm wafer defect review system. Its greatest breakthrough lies in providing "molecular-level" chemical identification for extremely tiny defect particles, helping wafer fabs trace the sources of contamination at lightning speed and boost chip yields.

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Briefly

1. (Molecular Particle Characterization):
2. (Revolutionary Sensitivity):
3. (Innovative Signal Enhancement)
4. (Yield & Cost Savings): 

Features

  • Molecular Particle CharacterizationUnlike traditional inspection equipment that can only "see" a defect, Explorer analyzes the molecular composition of particles. It precisely identifies whether the contaminant is a metal, organic material, silica, or another specific substance. This allows engineers to immediately target the exact processing tool or pipeline causing the pollution.
  • Revolutionary Nanoscale SensitivityUtilizing proprietary optical and physical technologies, the system captures and identifies extremely tiny nanoparticles down to 8 nanometers (nm) in size.
  • Innovative Signal EnhancementExplorer combines two proprietary technologies:Vacuum Plasma Coating Technology: It applies a temporary, specialized thin film to the wafer surface, making tiny impurities "glow" under optical microscopes to drastically boost visibility.Surface-Enhanced Raman Spectroscopy (SERS): It records the "molecular fingerprint" of individual nanoparticles, enabling high-speed, high-precision contamination identification.
  • Yield and Cost SavingsThrough real-time, in-line review, wafer fabs catch tool anomalies early in the process before contamination spreads. This prevents entire batches of wafers from being scrapped, thereby optimizing production yields and reducing carbon emissions.
  • Tool IntegrationAutomation: Automated in-line system.Modules: Equipped with standard EFEM (Equipment Front End Module) and FOUP load ports.
  • Factory Connection: Enables seamless, direct integration with the wafer fab's Automated Material Handling System (AMHS).
  • Product SpecificationsApplicable Wafer Size: Standard 300 mm (12-inch) wafers.
  • Process Compatibility: Supports advanced logic processes (3nm and below) and high-end memory processes.

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