QuantumDiamonds is a global leader in quantum sensing technology for semiconductor analysis, delivering advanced solutions for non-destructive, high-resolution 3D failure analysis. Leveraging the unique properties of nitrogen-vacancy (NV) centers in diamond, our systems enable direct visualization of electrical activity and current flow- capabilities that go far beyond conventional techniques.
Our technology empowers semiconductor manufacturers to identify, localize, and understand failure mechanisms faster and more accurately, reducing time-to-root-cause and accelerating yield improvement. By bridging cutting-edge quantum physics with real-world engineering challenges, QuantumDiamonds is redefining how the industry approaches failure analysis and paving the way for more reliable and efficient next-generation devices.
The FRT MicroProf series is a high-precision metrology solution designed for the semiconductor industry, enabling comprehensive geometric measurements of wafers, including thickness, TTV (Total Thickness Variation), Bow, Warp, TIR (Total Indicated Runout), and LTV (Local Thickness Variation). Utilizing a white light source and a dual-probe configuration (top and bottom), the system performs non-contact measurements by positioning the wafer between the probes, allowing for efficient and accurate analysis in a single pass.
An optional infrared (IR) probe enhances measurement capabilities by enabling penetration of materials like silicon (Si) and gallium arsenide (GaAs), making it ideal for monitoring thickness changes during the backside thinning process. The system supports both manual and automated configurations to meet varying production needs.
- Standard fixture supports samples from 2 to 12 inches
- Measures thickness, TTV, Bow, and Warp on opaque and transparent materials
- Optional IR probe for non-destructive layer thickness measurement on Si/GaAs
- Ideal for incoming inspection, EPI process monitoring, and thinning process control
- Available in manual (MicroProf 200/300) and automated (MicroProf 200/300 MHU) models
- Integrated mapping function for multi-point measurement and wafer map generation
- Built-in reference wafers for fast and accurate thickness calibration
