WAFTECH

Sorter equipment is a key device used for automated sorting, transmission, and classification in multiple industrial fields, playing a particularly critical role in semiconductor manufacturing. It enables efficient and precise handling of wafers, ensuring continuity of the production process and consistency in product quality.

※Core Functions of Sorter in Semiconductor Manufacturing
In the chip production process, the Sorter is primarily used for automated batch separation, merging, flipping, position calibration, and classification of wafers. Its main functions include:

Features

• Customizable with ‌N‌ load ports (N=2~8) to meet diverse customer application requirements
• Optional features: ‌flip function‌, ‌N₂ purge‌
• Available in ‌vacuum suction‌ and ‌edge grip‌ types
• Compatible with ‌200mm‌ and ‌300mm‌ wafers and  Panel-level (Optional)

• Front-end Processes‌: Preparing wafers before photolithography, deposition, and other processes, including pre-processing and loading preparation.
   
• ‌Back-end Packaging and Testing‌: Sorting wafers after testing, distinguishing between good and defective units.
   
• Reclaimed Wafer Production Lines‌: Classifying and packaging wafers after cleaning and polishing; companies like CXG Integrated have deployed 8-inch and 12-inch silicon wafer sorters (SORTER) in their production lines.

• SEMI-S2
• SEMI-S23
• SEMI-F47

EFEM (Equipment Front End Module): Detailed Introduction‌

The EFEM (Equipment Front End Module) is a core subsystem in modern semiconductor manufacturing, responsible for automated wafer handling. It is widely used in critical processes such as lithography, etching, and thin-film deposition. Acting as a "bridge" between wafer carriers (e.g., FOUPs, SMIF pods) and process tools, the EFEM enables precise, contamination-free transfer of wafers within a highly controlled clean environment, ensuring high efficiency and process stability.

Features

• Covering all types of processes/testing equipment in the field of chip manufacturing
• Customizable with ‌N‌ load ports (N=1~6) to meet diverse customer application requirements
• Optional features: ‌flip function‌, ‌N₂ purge‌
• Available in ‌vacuum‌ and ‌edge grip‌ and passive grip types
• Compatible with ‌200mm‌ and ‌300mm‌ wafers (optional)

• ‌Supports handling of ultra-thin wafers (≤50μm) in advanced packaging processes 
• ‌Multi-size Wafer Compatibility‌: Seamlessly switches between 200mm and 300mm wafers, enabling flexible production without downtime.
• MES Integration‌: Uses SECS/GEM protocol for automatic wafer ID recognition, batch tracking, and real-time production scheduling.

• SEMI-S2
• SEMI-S23
• SEMI-F47

The Overhead Hoist Transfer (OHT) system is a core automated material handling solution in modern semiconductor manufacturing, especially critical in 300mm wafer fabs. Suspended from ceiling-mounted tracks, OHT vehicles transport FOUPs (Front Open Unified Pods) between process tools, buffers, and stockers, forming the "aerial logistics backbone" of fully automated semiconductor factories.

Features

• Applicable environment: Class 100
• Maximum linear speed of straight rail: 5m/s
• Maximum acceleration value: 2m/s2
• Maximum deceleration value: 3m/s2
• Maximum curve linear speed: 1m/s
• Carrying capacity: MAX 16Kg

• In-Fab Material Handling‌:Enables fully automated FOUP transfer between process tools, OHBs (Overhead Buffers), and Stockers—standard in 300mm wafer fabs.
• Inter-Zone / Multi-Floor Transport‌:Supports long-distance and multi-level wafer movement, facilitating coordination across different production lines in large-scale fabs.
• Lights-Out Manufacturing‌:Integrated with MES and MCS for end-to-end automation, enabling "dark fab" operations with minimal human intervention.
• Digital Twin & Predictive Maintenance‌:Uses 3D visualization and digital twin technology for real-time monitoring, fault prediction, and operational optimization.
• Cross-Industry Applications‌:Expanding into lithium battery electrode handling, garment cutting material transport, and genetic sequencing sample delivery—where cleanliness and space efficiency are critical.

• SEMI-S2

An Autonomous Mobile Robot (AMR) is a self-navigating material handling system that perceives its environment, builds maps in real time, and plans dynamic paths without fixed infrastructure. Unlike AGVs, AMRs use LiDAR, cameras, and SLAM algorithms to operate flexibly in dynamic, human-shared environments.

Core Capabilities‌

• ‌1.Environmental Perception‌: Multi-sensor fusion (LiDAR, 3D vision, ultrasonic) for real-time obstacle detection.
• 2.‌SLAM Mapping & Localization‌: Simultaneous localization and mapping without pre-installed markers.
• ‌3.Dynamic Path Planning‌: Uses A*, RRT, or Dijkstra algorithms to reroute around obstacles and optimize travel.
• ‌4.Multi-Robot Coordination‌: Cloud-based fleet management enables 100+ robots to operate efficiently without collisions.
• 5.‌System Integration‌: Seamless API connectivity with WMS, MES, ERP for end-to-end digital workflow automation.

Features

• High Flexibility‌ No infrastructure modification required; deployment in days, not weeks.
• Strong Adaptability‌ Operates in narrow aisles, multi-floor facilities, and mixed human-robot environments.
• Intelligent Coordination‌ AI-driven task assignment and traffic optimization for large-scale fleets.
• Scalability‌ Modular top modules (lifters, conveyors, robotic arms) enable task versatility.

• Automotive Manufacturing‌: Just-in-time delivery of parts to assembly stations.
• New Energy (Lithium-ion / PV)‌: Clean handling of electrodes, cells, and solar panels in ISO-class environments.
• 3C Electronics‌: Seamless material flow between SMT, testing, and packaging lines.
• ‌Smart Factories‌: Automates inbound/outbound logistics, line-side feeding, and finished goods staging.