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MIRTEC

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The best 3D inspection solution for improving SiP.

  • Combined inspection method using 2D vision, phase shift profilometry (Moiré), and hybrid laser scanning
  • Accurate 3D measurement on highly reflective, translucent, and low reflective materials
  • 3D inspection for extremely small components and high-density component arrays
  • Coaxial light applied to inspect crack defects on CSP components

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