Axus Technology, headquartered in Chandler, Arizona, is a global OEM providing advanced surface processing solutions since 2002. Serving industries such as semiconductors, MEMS, automotive, defense, aerospace, life sciences, and IoT, Axus delivers state-of-the-art CMP tools and technologies. With expertise in polishing, wafer cleaning, precision wafer grinding, and support for legacy tools, Axus stands out as a highly specialized technology supplier. We offer consulting services that focus on engineering efficiency and capability, supporting the evolving needs of the CMP market.

CS200 series

The Capstone® CS200 series is Axus Technology’s next-generation CMP processing platform, delivering industry-leading wafer polishing performance for 100mm, 150mm, and 200mm wafers. Designed with a high-throughput load-polish-unload sequence, this system ensures a compact footprint and reduced cost of ownership. It achieves 40–50% lower slurry usage and features a pad conditioning system that extends pad life up to 2x longer than traditional tools.

CS200-ma (Multi-Load/Unload Aquarius Cleaner Configuration): Functions as a standalone CMP tool or fully automated Dry-in Dry-out system with integrated double-sided post-CMP cleaner. Supports dual wafer sizes simultaneously as a true bridge tool.
CS200-sa (Standalone Configuration): Offers the most compact footprint and highest flexibility. Processes two wafer sizes without hardware or software changes. True bridge tool operation.
CS200-ia (Integrated Aquarius Cleaner Configuration): Advanced CMP platform with fully integrated double-sided post-CMP cleaning for Dry-in Dry-out applications. True bridge tool capable of handling dual wafer sizes simultaneously.