Scientech proudly marked a major milestone today (March 23, 2026) with the successful topping-out ceremony of its Hukou Plant 2. This achievement not only signals that construction has entered its final phase, but also underscores the company’s strategic positioning to capture the rapidly growing demand for semiconductor equipment driven by the AI revolution.
1.Driving Growth with Capacity and Innovation
With operations scheduled to commence by the end of this year, Hukou Plant 2 will significantly expand Scientech’s manufacturing capacity for in-house equipment, including wet process systems and advanced packaging solutions for 2.5D and 3D technologies. This expansion is critical in addressing the current supply-demand imbalance in AI chip foundry capacity. In particular, wet process equipment plays an essential role in enabling high-performance advanced packaging.
2.Positioned for the AI Era
The surge in AI applications is driving strong demand for wafer-level packaging (WLP) and panel-level packaging (PLP). The launch of Hukou Plant 2 is well-timed to align with the semiconductor industry’s projected high-growth cycle from 2026 to 2030. With strong order visibility, Scientech is demonstrating solid competitiveness—especially in its proprietary equipment supporting advanced AI manufacturing processes.
3.Strengthening Future Expansion
Beyond Hukou Plant 2, Scientech is continuing to invest in long-term growth. The company’s expansion project in Tainan, expected to be completed by the end of 2027, further reflects its commitment to scaling capacity and reinforcing its leadership in the semiconductor equipment industry.
