Scientech Product

12" Wafer Reclaim Service

semiconductor baking, wafer baking, preform baking, pre-underfill baking, batch baking

batch panel level wet process, panel level wet process, panel level cleaning, batch panel level, panel level packaging

semiconductor debonding cleaning, debonding cleaning,semiconductor cleaning, glass cleaning, glue removal

Temporary debonding, Taiko debonding, Frame debonding, wafer thinning, BGBM, glass debonding

LTHC coating, semiconductor coating, release layer coating, wafer thinning, glass release layer coating, glass release layer

panel level packaging, panel level release layer coating, panel level release layer, panel level coating

panel level packaging, panel level wet process, panel level cleaning, panel level UBM etching, panel level wet etching

single wafer wet process, wet process, semiconductor wet process, single wafer cleaning, UBM etching, wet etching

temporary bonding, wafer thinning, glass bonding, wafer bonding, BGBM

batch wet process, wet bench, wet process, wafer cleaning, wet etching

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