AMC

Founded in 1995, the company specializes in the R&D and production of advanced semiconductor packaging, optical and functional films, and adhesive materials. It possesses extensive experience in protective film manufacturing, optical film cutting, adhesive formulation development, and marketing. Focusing on advanced material supply, the company leverages unique core technologies to develop and provide diverse adhesive insulating, optoelectronic, and semiconductor adhesive film materials. It has demonstrated concrete product development achievements in Fan-Out Wafer-Level Packaging (FOWLP), Fan-Out Glass Substrate Packaging (FOPLP), and 2.5D/3D advanced heterogeneous integration packaging materials. Particularly in the semiconductor advanced packaging materials market, its product portfolio includes wafer-level/ panel-level anti-warpage materials.

Anti-warpage Balance Film

The core technology involves developing specialized functional polymer material formulations to achieve resistance to acids, alkalis, heat, ultra-high vacuum, and other demanding conditions in semiconductor manufacturing processes. These formulations are processed into thin films and adhesive materials using precision coating equipment. By controlling material tension or thermal shrinkage properties, warpage values are effectively managed.
 
Features

▪ High adhesion and fixation
▪ Controlling wafer warpage
▪ High vacuum
▪ Low pollution
▪ Excellent Temp resistance
▪ Chemical resistance
▪ Process stability:
▪ Easy de-taping:
▪ Wide applicability for wafer and panel level

Application

Applicable to chip-first or chip-last:
▪ Fan-out glass substrate packaging (FOPLP)
▪ Fan-out wafer-level packaging (FOWLP)
▪ 2.5D/3D advanced heterogeneous integration packaging materials
▪ Heterogeneous packaging integration
▪ AI high-speed chip testing

Specification

Different balancing molds correspond to different process conditions:
•RDL Process (Carrier: Glass/Silicon)
•Bump & Reflow Process (Carrier: EMC)

 

     

  

  

 

 

                                          

 

 

Content changed at :2025-09-02 14:33:45
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