Temporary Bonding Equipment-Pyxis TB Series

Scientech, in collaboration with global leader 3M, has developed the Pyxis series Temporary Bonding Equipment, providing solutions for glass bonding processes in wafer thinning and BGBM (Backside Grinding & Backside Metallization). In addition, leveraging its professional in-house equipment development capabilities in the semiconductor field, Scientech has developed temporary bonding equipment applicable to advanced semiconductor packaging processes.

• High-efficiency production equipment
• Lower consumables cost (Low CoO)
• No wafer cleaning required after debonding

The Pyxis series temporary bonding equipment can be applied in:

• Semiconductor wafer thinning
• BGBM (Backside Grinding & Backside Metallization),
• Compound semiconductor thinning (SiC/GaN)
• Advanced semiconductor packaging

Its applicable process is:

• Temporary bonding