The increasing demand for electronic equipment is driven by factors such as the escalation of digital transformation, consumer electronics, IoT, automotive electronics, industrial automation, communication infrastructure, and emerging technologies. Semiconductors serve as the foundation for these technologies, enabling the development of advanced and interconnected electronic devices that cater to diverse industry needs.
Further, the semiconductor industry significantly contributes to economic growth and competitiveness. Mass production of semiconductors stimulates job creation, attracts investments, and enhances the competitiveness of nations in the global market. It strengthens the overall economy by driving innovation, supporting related industries, and generating revenue.
The accelerated usage of electronic devices and the ongoing digital transformation have indeed created a strong need to increase the mass production of semiconductors. However, a limited number of semiconductor companies are involved in producing the core technology. Increasing mass production and simultaneously maintaining the quality of fabrication can ensure the stability in global supply chain. Fabrication of semiconductor devices and ICs consists of numerous steps and processes involving wet and dry processes. Here is the general overview of the fabrication process, wafer preparation, cleaning, photolithography, developing, etching, cleaning, ion implantation, deposition, CMP, dicing, wire bonding, and packaging. The packaged devices are mounted onto circuit boards or other substrates, and they may undergo additional assembly steps to create the final electronic products, there are several more steps involved, along with various intricate technologies and techniques employed at each stage which may vary according to the requirements and products. Among these processes, several processes are categorized into dry and wet approaches. Further, the wet approach is classified as a single-wafer and bench process. The single-wafer process is highly used in FEOL for high precision but is time-consuming on the other hand wet bench process is highly used in BEOL for high yield and it conserves time. Etching, stripping, developing, and cleaning are considered to be highly crucial wet bench processes for semiconductor manufacturing. At present, wet bench technology has matured in dual aspects to deliver high yield while maintaining high precision.
Scientech Corporation is a well-established Taiwanese semiconductor equipment merchandiser with more than 40 years of experience. With a rich background in designing and manufacturing spanning over 15 years, Scientech has consistently provided top-notch products and effective support to clients across diverse industries. These sectors include LED, Mini/Micro LED, compound semiconductors, and power components.
Scientech’s wet process equipment has been successfully implemented in the fabrication of the recent chipset 3DIC, CoWoS and advanced packaging process. It has been incorporated into mass production, allowing customers to reap the benefits of this innovative packaging technique in a cost-effective approach. The ability to customize the equipment and interface led to fine-tuning the process for specific clients for certain tasks thus resulting in reducing the overall cost of ownership (CoO).
Scientech has established itself as a trusted partner in the semiconductor industry by offering reliable wet process equipment. Their expertise and innovative solutions contribute to the success of their customers in various segments of the semiconductor market.
