Warpage Handling Solution for Wafer & Panel
Wafer warpage is a critical challenge in advanced semiconductor processes, particularly with thin wafers, heterogeneous integration. Warpage can lead to misalignment, transfer failures, and significant yield loss. To tackle these challenges, Scientech together with AMC has developed an integrated solution tailored to modern manufacturing demands.
Challenges We Address
- Warpage resulting from wafer thinning, thermal stress, or material mismatches
- Alignment errors during photolithography and bonding steps
- Mechanical stress or breakage during wafer handling and chucking
Our warpage handling system combines mechanical innovation, intelligent automation, and optimized process controls. The solution ensures stable performance and high yield, even with warped wafers. Designed for both 12-inch and panel, it supports key process modules in the process line.
This solution is ideally suited for semiconductor fabs involved in:
- 2.5D/3D integration
- Panel-Level Packaging (PLP)
- Fan-Out Wafer-Level Packaging (FOWLP)
- Advanced interposer technologies
Our system is built around a proven lamination platform that withstands high temperatures, various concentrated chemicals, and ultra-low vacuum conditions to effectively minimize warpage and stabilize the substrate. This approach has been verified and approved by leading global semiconductor companies.
To learn more or discuss a customized configuration, please reach out to our technical team.
About Scientech
Scientech is a leading global provider of advanced semiconductor manufacturing equipment, specializing in wafer/Panel wet processing, bonding, debonding, and cleaning technologies. With a strong commitment to innovation and quality, Scientech partners with semiconductor manufacturers worldwide to enable the next generation of electronic devices.
