PacTech

PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. Since PacTech establishment, their team has been working relentlessly on developing new leading-edge technologies for the next generation applications. PacTech is known to be highly adaptive to customization and unique applications. Their team of technical experts is striving to resolve various packaging challenges faced by the industry to provide our customers and partners more competitive solutions in terms of cost, time-to-market, and technology advancement. PacTech headquarter is located in Nauen, Germany with two operation and manufacturing sites in Santa Clara, CA, USA and Penang, Malaysia. 

SB2 series–Laser Solder Jetting Equipment

SB2,植球/補球,雷射焊接,精密焊接,打線焊接

SB2 series – laser solder jetting technology is clean, precise, and flexible. The singulation disc will dispense a single solder ball into the capillary where the laser beam’s thermal energy
melts the solder ball, enabling it to fall onto any solder position and being reflowed immediately. It works with various solder alloys of different melting point and requires no flux  therefore it is clean. The localized heat and short pulse generated by the laser assures that minimal thermal stress is applied on the area beyond the joined surfaces. The single solder ball dispensing mechanism requires no tooling, hence enables flexible soldering location and contactless soldering.

Main features
  • Fluxless
  • Mask/Stencil-less
  • Clean
  • High placement accuracy
  • Contactless soldering
  • In-situ reflow for low thermal stress
Standard Certification

 

Application
  • BGA/PCB/cLCC Balling
  • Rework/Repair of BGA like Packages
  • MEMS & Advanced Package (2D/3D/3.5D packaging)
  • Wafer Level Packaging (Wafer Bumping/ Wafer Level CSP Bumping) 
  • TSV-Via Solder Filling/ Solder Stacking/ Sealing Processes
  • Optoelectronics/ Micro Optics/ Filter Devices/ Camera Modules/ Hard Disk Drive
Specification

 

LaPlace – Laser Soldering and Assembly Equipment

LaPlace,雷射焊接,黏晶,精密焊接

Using localized laser heating mechanism, temperature can be applied selectively in the interconnection areas of interest without heating up the entire substrate up to the reflow temperature to liquefy and reflow an interconnection of a few microns. With customized bond tool and laser technology, pick-and-place and assembly reflow heating are accomplished in single step at high accuracy <5µm. Localized heat ensures reliable bonding of large dies while the in-situ reflow supports ultra-small die assembly as small as 300µm.
LaPlace unique temperature control mechanism protects single chip or component from being over-heated and prevents substrate from warpage and repeating reflow circumstances.

Main features
  • Localized and selective heating with laser
  • Flexible laser beam shaping
  • High placement accuracy
  • Suitable for bonding materials with CTE-mismatch
  • Customizable bond tools
  • In-situ reflow for low thermal stress
Standard Certification

 

Application
  • Advanced Package (2D/3D/3.5D packaging)
  • Surface Mount Technology (SMT)
  • High presision for Filp-Chip /electronic components placement assembly
  • Probe cards assembly 
Specification

 

Content changed at :2023-08-28 17:12:19
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