PacTech is a technology-driven company specializing in advanced packaging equipment and wafer-level packaging services. Since its founding, PacTech has focused on developing next-generation technologies for emerging applications.
Renowned for its flexibility in customization and unique solutions, PacTech’s team of experts actively addresses industry packaging challenges to deliver cost-effective, time-efficient, and innovative solutions.
The company is headquartered in Nauen, Germany, with additional manufacturing and operations facilities in Santa Clara, California, USA, and Penang, Malaysia.
The SB2 series offers a clean, precise, and flexible laser solder jetting solution. A singulation disc dispenses one solder ball into a capillary, where a laser melts it, allowing accurate placement and instant reflow on the target area. Compatible with various solder alloys and requiring no flux, the process is clean and reliable.
Laser-generated localized heat and short pulses ensure minimal thermal stress outside the bonding zone. The single-ball dispensing system is tool-free, allowing flexible, contactless soldering at any location.
Key Features
- Fluxless
- Mask/Stencil-free
- Clean process
- High placement accuracy
- Contactless soldering
- In-situ reflow with minimal thermal stress
Using localized laser heating, temperature is selectively applied to targeted interconnection areas without raising the entire substrate to reflow temperature—ideal for reflowing micron-scale interconnects. Through customized bond tools and laser technology, pick-and-place and reflow heating are achieved in a single, highly accurate step (<5µm).
This localized approach enables reliable bonding of large dies and supports ultra-small die assembly down to 300µm. LaPlace’s unique temperature control prevents overheating of chips or components and avoids substrate warpage or repeat reflow damage.
Key Features
- Localized, selective laser heating
- Flexible laser beam shaping
- High placement accuracy
- Compatible with materials with CTE mismatch
- Customizable bond tools
- In-situ reflow with minimal thermal stress
