FrontPage-Temporary Bonding & Debonding Equipment (TBDB)

Scientech, in collaboration with global leader 3M, has developed the Pyxis series Glass Releasing Layer Coating Equipment which provides solutions for glass releasing layer coating in wafer thinning, BGBM (Backside Grinding & Backside Metallization), and advanced semiconductor packaging processes. 

Scientech, in collaboration with global leader 3M, has developed the Pyxis series Temporary Bonding Equipment, providing solutions for glass bonding processes in wafer thinning and BGBM (Backside Grinding & Backside Metallization). In addition, leveraging its professional in-house equipment development capabilities in the semiconductor field, Scientech has developed temporary bonding equipment applicable to advanced semiconductor packaging processes. 

Scientech, in collaboration with international leader 3M, has developed the Pyxis series Debonding Equipment, including Frame Debonding Equipment and Taiko Debonding Equipment, providing solutions for glass debonding processes in wafer thinning and BGBM (Backside Grinding & Backside Metallization). 

Leveraging its professional in-house equipment development capabilities in the semiconductor field, Scientech has developed the Pyxis series Debonding and Cleaning Equipment, providing solutions for glass and wafer cleaning after debonding in semiconductor wafer thinning processes and advanced packaging processes.