Founded in 1995, AMC specializes in the R&D and production of advanced semiconductor packaging, optical and functional films, and adhesive materials. It possesses extensive experience in protective film manufacturing, optical film cutting, adhesive formulation development, and marketing. Focusing on advanced material supply, the company leverages unique core technologies to develop and provide diverse adhesive insulating, optoelectronic, and semiconductor adhesive film materials. It has demonstrated concrete product development achievements in Fan-Out Wafer-Level Packaging (FOWLP), Fan-Out Glass Substrate Packaging (FOPLP), and 2.5D/3D advanced heterogeneous integration packaging materials. Particularly in the semiconductor advanced packaging materials market, its product portfolio includes wafer-level/ panel-level anti-warpage materials.
Anti-warpage Balance Film
- High adhesion and fixation
- Controlling wafer warpage
- High vacuum
- Low pollution
- Excellent Temp resistance
- Chemical resistance
- Process stability
- Easy de-taping
- Wide applicability for wafer and panel level
