Core Insight

The Model 7380d AirStat® Steady-State DC Bar Ionizer is specifically engineered for ultra-sensitive and high-speed device applications. Featuring the patented QuadPoint® nozzle design, this system ensures a truly low offset voltage unmatched by other technologies across the industry. Unlike AC switching systems, the steady-state DC ionization method does not produce induction fields, reducing the risk of ESD damage in advanced packaging processes, including 2.5D and 3D IC manufacturing.

Compact and versatile, the 7380d AirStat® Ionizer is ideal for space-constrained environments such as inside Automated Handling Equipment (AHE) and other critical areas. Its precise voltage control and exceptionally low peak offset make it perfectly suited for handling sensitive devices. It is also the only air-assisted bar ionizer compliant with the ANSI/ESD S20.20 program, meeting ion balance specifications of less than ±5 volts, with capabilities extending to single-digit voltage levels.

Key Features

• Steady-State DC ionization technology
• Patented QuadPoint® nozzle design
• Ion balance less than ±5 V
• Integrated ion balance alarms
• No high-voltage switching
• No induction field generation

• Input Voltage: 24 VDC, 300 mW Max
• Output Voltage: 0 to ±4.0kV, 10V resolution increment
• Ion Emission: Steady-State DC Technology
• Ion Balance: Less than ±5V or better per ANSI/ESD SP3.5
• Decay Time: Less than 2 second at 300 mm
• Output Control: IR Remote Controller
• Emitter Point: Single Crystal Silicon and Tungsten 99.99%
• Alarm: Visual & Audio alarm operates for balance alarm, HV
• Operating Environment: Temperature: 15 - 35, Humidity: 35 - 75% RH
• Dimensions (mm): H 62.5 mm x D 30 mm x L 350~790 mm

• Advanced packaging processes such as CoWoS, 2D, 3D, and 3.5D packaging: Require low-offset bar ionizers and point-of-use ionization to prevent ESD damage during high-density interconnect handling and fine-pitch assembly.
• Wafer-level packaging: Demands ionization solutions compatible with cleanroom environments and capable of maintaining ion balance within ±5 V to protect ultra-thin and sensitive wafer structures.
• PCB manufacturing: Needs targeted ionization for soldering, assembly, and automated handling to reduce electrostatic attraction of contaminants and prevent ESD faults.
• MEMS fabrication: Requires localized ionization with minimal airflow disturbance to protect delicate mechanical structures from particle contamination and electrostatic charge buildup.
• High-power and high-speed device processes: Benefit from steady-state DC ionization systems with low induction fields to avoid triggering latch-up or damage in devices with tight ESD tolerances.

Tribocharging is a common source of electrostatic discharge (ESD), and induced fields from insulators must be strictly controlled within ESD Protected Areas (EPAs). Insulating materials essential to certain processes are used widely and must be neutralized using ionization systems to prevent charge accumulation.

The Model 3810E ionizing blower, featuring CoreStat® self-balanced technology, is engineered to meet Class 0 ESD requirements. It is ideal for semiconductor back-end operations, PCB assembly, and general electronics manufacturing. The blower requires no routine calibration, and its self-balancing design ensures consistently low offset voltage.

Integrated with Facility Monitoring System (FMS) support, the 3810E offers real-time status reporting. The unit features both visual (LED) and audible (buzzer) alarms for HV power failure and out-of-balance conditions. A built-in auto-cleaning brush significantly reduces maintenance time and costs.

Key Features

• Meets Class 0 ESD standards
• CoreStat® self-balanced technology for consistent performance
• Automatic safety stop function
• Visual and audible alarm indicators
• Integrated FMS interface for real-time monitoring
• Built-in auto-cleaning mechanism

• Input Voltage: 24 VDC, 10.6 W Max
• lon Emission: Steady-state DC Technology
• lon Balance: < ±5 V
• Discharge Time: ±1000 V to +100 V less than 1 sec (30cm); +1000 V to +100 V less than 3 sec (60cm)
• Air Flow: 140 CFM
• Monitoring: FMS Interface
• Operating Environment:Temperature: 15-35°C; Humidity: 35 - 75% RH
• Dimensions (mm): W 188 mm x H 205 mm x D 77 mm

• Advanced packaging processes such as CoWoS, 2D, 3D, and 3.5D packaging: Require low-offset bar ionizers and point-of-use ionization to prevent ESD damage during high-density interconnect handling and fine-pitch assembly.
• Wafer-level packaging: Demands ionization solutions compatible with cleanroom environments and capable of maintaining ion balance within ±5 V to protect ultra-thin and sensitive wafer structures.
• PCB manufacturing: Needs targeted ionization for soldering, assembly, and automated handling to reduce electrostatic attraction of contaminants and prevent ESD faults.
• MEMS fabrication: Requires localized ionization with minimal airflow disturbance to protect delicate mechanical structures from particle contamination and electrostatic charge buildup.
• High-power and high-speed device processes: Benefit from steady-state DC ionization systems with low induction fields to avoid triggering latch-up or damage in devices with tight ESD tolerances.