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半導體、LED、化合物半導體於PR Baking、Molding前、Underfill前去水氣等烘烤製程所使用之低溫自動化烤箱，烘烤形式包含水平烘烤及垂直烘烤

Fully auto low temp. baking system designed for PR Baking, Steam removal before Molding and Underfill in Si semiconductor, LED and Compound semiconductor field.

Support both Vertical and Horizontal direction in one tool.