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Your search for "advanced energy" gave back 16 results.

Circuit board/ Robot/ Power repair and overhaul

Circuit board

Most circuit boards in semi-conductor equipment can be repaired without circuitry. Under carefully repaired, co-work with users to test it on their own equipment, there are about 80% successful rate.Truly, repaired is not difficult, its how to prevent same root cause happen again. 

In Scientech, weve experienced engineers, systematization team work and continuing improved study in order to give our customer reliable service.
Scientech provides all kinds of suitable instrument tools without side effect such as PCB trouble shooter, In circuit Tester, BGA rework tool, capacitance tester, Power supply tester, High frequency constant temperature soldering iron, electric tin sucker, soldering pot, and microscope system, etc...

Under our professional repairing and service, your goods will optimize as a new one. Scientech appreciates to co-work with customers in any projects.For example: To modify and improve PCB abilities to reduce fail rate,and even to repair PCB which already out of production.

Key components repairing

Scientech supplies all kinds of the key components repairing. Even with the equipments we are not distributing, we also can collaboration and develop with customer.

Robot repairing

  • Scientech represents Kensington. For Kensington robot sale and repair, please refer to : Kensington automation 
  • Scientech represents Nidec-Genmark. For Nidec-Genmark robot sale and repair, please refer to : Nidec-Genmark automation

Power repair and overhaul

  • Scientech represents Dynatronix. For Dynatronix power sale and repair, please refer to : Dynatronix power
  • Scientech represents Advanced Energy (AE). For AE power sale and repair, please refer to : Advanced Energy (AE)
Content changed at :2019-08-08 11:16:17

PacTech

PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. Since PacTech establishment, their team has been working relentlessly on developing new leading-edge technologies for the next generation applications. PacTech is known to be highly adaptive to customization and unique applications. Their team of technical experts is striving to resolve various packaging challenges faced by the industry to provide our customers and partners more competitive solutions in terms of cost, time-to-market, and technology advancement. PacTech headquarter is located in Nauen, Germany with two operation and manufacturing sites in Santa Clara, CA, USA and Penang, Malaysia. 

SB2 series–Laser Solder Jetting Equipment

SB2,植球/補球,雷射焊接,精密焊接,打線焊接

SB2 series – laser solder jetting technology is clean, precise, and flexible. The singulation disc will dispense a single solder ball into the capillary where the laser beam’s thermal energy
melts the solder ball, enabling it to fall onto any solder position and being reflowed immediately. It works with various solder alloys of different melting point and requires no flux  therefore it is clean. The localized heat and short pulse generated by the laser assures that minimal thermal stress is applied on the area beyond the joined surfaces. The single solder ball dispensing mechanism requires no tooling, hence enables flexible soldering location and contactless soldering.

Main features
  • Fluxless
  • Mask/Stencil-less
  • Clean
  • High placement accuracy
  • Contactless soldering
  • In-situ reflow for low thermal stress
Standard Certification

 

Application
  • BGA/PCB/cLCC Balling
  • Rework/Repair of BGA like Packages
  • MEMS & Advanced Package (2D/3D/3.5D packaging)
  • Wafer Level Packaging (Wafer Bumping/ Wafer Level CSP Bumping) 
  • TSV-Via Solder Filling/ Solder Stacking/ Sealing Processes
  • Optoelectronics/ Micro Optics/ Filter Devices/ Camera Modules/ Hard Disk Drive
Specification

 

LaPlace – Laser Soldering and Assembly Equipment

LaPlace,雷射焊接,黏晶,精密焊接

Using localized laser heating mechanism, temperature can be applied selectively in the interconnection areas of interest without heating up the entire substrate up to the reflow temperature to liquefy and reflow an interconnection of a few microns. With customized bond tool and laser technology, pick-and-place and assembly reflow heating are accomplished in single step at high accuracy <5µm. Localized heat ensures reliable bonding of large dies while the in-situ reflow supports ultra-small die assembly as small as 300µm.
LaPlace unique temperature control mechanism protects single chip or component from being over-heated and prevents substrate from warpage and repeating reflow circumstances.

Main features
  • Localized and selective heating with laser
  • Flexible laser beam shaping
  • High placement accuracy
  • Suitable for bonding materials with CTE-mismatch
  • Customizable bond tools
  • In-situ reflow for low thermal stress
Standard Certification

 

Application
  • Advanced Package (2D/3D/3.5D packaging)
  • Surface Mount Technology (SMT)
  • High presision for Filp-Chip /electronic components placement assembly
  • Probe cards assembly 
Specification

 

Content changed at :2023-08-28 17:12:19
  • 繁體中文

Axus Technology Signs Scientech as Exclusive Distribution Partner for China and Taiwan, Expanding Global Footprint

Axus Technology Signs Scientech as Exclusive Distribution Partner for China and Taiwan, Expanding Global Footprint

Strategic Partnership Expedites Sales, Service and Support of Axus’s
CMP Processing and Cleaning Systems for Customers in Region

CHANDLER, Ariz., October 31, 2024 – Axus Technology, a leading global provider of chemical mechanical planarization (CMP) equipment, critical for semiconductor and compound semiconductor fabrication, today announced it has entered into a strategic distribution agreement with Scientech Corporation (Taipei, Taiwan). Scientech will now provide sales, installation, service, parts, process development assistance and technical support throughout China and Taiwan for Axus's Capstone CMP platform and Aquarius wafer-cleaning tools – designed specifically for processing complex compound semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN), as well as for other fast-growing markets such as advanced packaging.

In response to growing demand from key markets such as artificial intelligence (AI), renewable energy and automotive, compound semiconductor wafer production in the region is growing rapidly. According to Yole Group, China captured more than one-third of the SiC wafer and epi wafer market in 2023. Taiwan is also gaining notice for its government-funded program focused on gallium nitride epitaxial crystal growth on 200mm QST substrates (GaN-on-QST). These efforts heighten the need for capital equipment like Axus’s Capstone systems, which are optimized to meet these materials’ challenging process requirements.

“It’s exciting to see new development projects and applications in China and Asia that are  creating new opportunities for compound semiconductors,” said Axus Technology CEO Dan Trojan. “Partnering with Scientech, which represents many well-known providers of capital equipment in the region, will ensure that customers have access not only to our product offerings but also to state-of-the-art service and support.”

“Axus Technology has demonstrated impressive success in building its customer base in North America and Europe,” said MT Hsu, CEO, Scientech Corp. “We look forward to helping the company expand its presence in Asia as demand for its high-performance, innovative CMP technology continues to accelerate.”

About Scientech Corporation
Scientech Corporation was established in 1979 and has headquarters in Taipei, Taiwan, with five additional offices across Taiwan and 10 offices in China. Scientech provides full sales, installation, service, parts, process development assistance and technical support for all representing equipment, tools and products. To learn more, visit www.scientech.com.tw 

About Axus Technology
Led by its state-of-the-art Capstone® CMP and Aquarius™ wafer-cleaning platforms, Axus Technology is a recognized industry leader in designing and building modern, flexible next-generation equipment and providing custom process-development services. Axus enables companies of all sizes, from startups to high-volume manufacturers, to test, develop, and implement leading-edge solutions—particularly for novel and emerging materials—process integration schemes, products and applications. Axus’s equipment solutions range from low cost-of-ownership entry-level tools to state-of-the-art high-volume manufacturing systems. Process testing, development, optimization, and scaling are supported by our process applications lab and foundry, which includes a full array of process equipment and supporting metrology, and is staffed by the industry’s most experienced CMP team. For more information, visit www.axustech.com 

Media Contacts:
Axus Technology                                    Kiterocket 
Emilie Marenec                                      Lisa Gillette-Martin
T: 480-331-4981                                     T: 408-205-4732
E: emarenec@axustech.com                 E: lgmartin@kiterocket.com 

 

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Content changed at :2024-11-04 09:49:05
  • 繁體中文

Axus Technology 與 Scientech 簽約成為中國大陸和臺灣的獨家代理合作夥伴

Axus Technology Signs Scientech as Exclusive Distribution Partner for China and Taiwan, Expanding Global Footprint

Strategic Partnership Expedites Sales, Service and Support of Axus’s
CMP Processing and Cleaning Systems for Customers in Region

CHANDLER, Ariz., October 31, 2024 – Axus Technology, a leading global provider of chemical mechanical planarization (CMP) equipment, critical for semiconductor and compound semiconductor fabrication, today announced it has entered into a strategic distribution agreement with Scientech Corporation (Taipei, Taiwan). Scientech will now provide sales, installation, service, parts, process development assistance and technical support throughout China and Taiwan for Axus's Capstone CMP platform and Aquarius wafer-cleaning tools – designed specifically for processing complex compound semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN), as well as for other fast-growing markets such as advanced packaging.

In response to growing demand from key markets such as artificial intelligence (AI), renewable energy and automotive, compound semiconductor wafer production in the region is growing rapidly. According to Yole Group, China captured more than one-third of the SiC wafer and epi wafer market in 2023. Taiwan is also gaining notice for its government-funded program focused on gallium nitride epitaxial crystal growth on 200mm QST substrates (GaN-on-QST). These efforts heighten the need for capital equipment like Axus’s Capstone systems, which are optimized to meet these materials’ challenging process requirements.

“It’s exciting to see new development projects and applications in China and Asia that are  creating new opportunities for compound semiconductors,” said Axus Technology CEO Dan Trojan. “Partnering with Scientech, which represents many well-known providers of capital equipment in the region, will ensure that customers have access not only to our product offerings but also to state-of-the-art service and support.”

“Axus Technology has demonstrated impressive success in building its customer base in North America and Europe,” said MT Hsu, CEO, Scientech Corp. “We look forward to helping the company expand its presence in Asia as demand for its high-performance, innovative CMP technology continues to accelerate.”

About Scientech Corporation
Scientech Corporation was established in 1979 and has headquarters in Taipei, Taiwan, with five additional offices across Taiwan and 10 offices in China. Scientech provides full sales, installation, service, parts, process development assistance and technical support for all representing equipment, tools and products. To learn more, visit www.scientech.com.tw 

About Axus Technology
Led by its state-of-the-art Capstone® CMP and Aquarius™ wafer-cleaning platforms, Axus Technology is a recognized industry leader in designing and building modern, flexible next-generation equipment and providing custom process-development services. Axus enables companies of all sizes, from startups to high-volume manufacturers, to test, develop, and implement leading-edge solutions—particularly for novel and emerging materials—process integration schemes, products and applications. Axus’s equipment solutions range from low cost-of-ownership entry-level tools to state-of-the-art high-volume manufacturing systems. Process testing, development, optimization, and scaling are supported by our process applications lab and foundry, which includes a full array of process equipment and supporting metrology, and is staffed by the industry’s most experienced CMP team. For more information, visit www.axustech.com 

Media Contacts:
Axus Technology                                    Kiterocket 
Emilie Marenec                                      Lisa Gillette-Martin
T: 480-331-4981                                     T: 408-205-4732
E: emarenec@axustech.com                 E: lgmartin@kiterocket.com 

 

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Content changed at :2024-11-04 16:55:24
  • English

FlowVIEW

A startup company from ITRI, the largest R&D organization in Taiwan
Nano-scale Liquid Imaging Inspection solution provider
Innovative sample holder design for micro-environment simulation in EM

1. We provide Flow AOI total solution, which can be applied in fields such as semiconductor, energy, biochemistry and pharmaceuticals. 
2. We adopt internationalized management and look out to the market worldwide. Our products have been successfully sold to semiconductor plants, material suppliers, testing service providers, academic and national level research institutions in Japan, Korea, the US, and Europe.
3. We receive guidance on worldwide market and commercial layout from the consultant of Silicon Valley, US, and collaborate with ITRI worldwide office to link commercially with internationally known manufacturers.providers, academic and national level research institutions in Japan, Korea, the US, and Europe.

Aquarius - Liquid static cell

Detailed description
Aquarius is the pioneer of using e-beam to test original fluids and liquid samples.
Aquarius can test and monitor coating materials in their original form, especially the liquid state.
The functions of the chip and liquid sample holder are versatile (disposable version for slurry testing, inline version for process monitoring, quick assembly version for electrode testing) and high-resolution inspection simultaneously.
The system is capable of displaying the images of sample in its liquid state under original conditions and providing analysis results such as particle size distribution, dispersity, uniformity, concentration, shape and composition required for R&D and production.
The liquid sample holder in the MFC system is compatible with different preparation tools (such as powder disperser for powder size distribution analysis, centrifuge for bio-sample morphology observation and membrane filter for liquid defect identification) for static inspection in various applications. The sample in the holder can be transferred to different inspection platforms to obtain the correlative information and make versatile and in-depth analysis of the sample possible.

Main features
  1. Simple:The liquid sample holder has special mechanical design to boost the operation efficiency and can finish the sample loading within 0.5 minute.
  2. High Resolution:Objects smaller than 10 nm can be easily observed
  3. High Compatibility:Highly compatible with various models ( FEI   JEOL  Hitachi ZEISS Phenom TSCAN TEMIC … )
    It can be a shuttle to an Optical microscope/Fluorescence microscope for in-situ observation.
  4. Customized:It can be placed with the silicon wafer & biochip substrate  for in-situ observation.
Standard Certification

 

Application
  1. CHEMICAL MECHANICAL POLISHING SLURRY
    • Slurry paticle size and composition analysis; partivle aggregation and dispersibility analysis, solving the problem in monitoring manufacturing process defects.
  2. METAL PLATING
    • In PCB manufacturing process,precipitation of heavy metal particles in degraded electroplating liquid causes abnormal end product . therefore , in-situ monitoring analysis is required.
  3. PAINT & COATING MATERIAL
    • Analysis of the actual particle distribution in the paint or coating suspension.
  4. SOLDER PASTE, THERMAL GREASE AND PACKAGING SILVER GLUE
    • Liquid manufacturing process analysis , exclude abnormality in the related pastes and silver glue in product manufacturing process.
Specification

Ultra-thin sample adaptive chips

Produced using the semi-conductor manufacturing process together with surface treatment, the membrane can be made hydrophobic, hydrophilic or bifunctional linkers for different applications, allowing samples under test to automatically adhere to the observation window for best image resolution. To ensure image quality, the membrane thickness is designed to be less than 30 nm, yet it is made robust by adjusting the window size and shape to withstand the pressure difference between the vacuum and atmosphere.

Electron microscope, aggregation, particle, nanometer, liquid electron microscope

Mercury - Liquid flow cell

Auto sampling systemPerform dynamic sampling between different samples,Monitor system manipulate without location limits.Conduct customized temperature control and water level supplementation.Conduct auto sample supplementation

Main features
  1. Breakthrough : Fluid dynamic specimens can be inspected in SEM
  2. Customization : 
    • Corrosion-resistant kit
    • Ability to switch different liquid inlets (Fluid mixing 20 in 1 out) 
  3. VERSATILITY : Precise temperature and electrical reaction control
  4. User friendly : Equipped with advanced automated measurement software with remote touch control panel.
Standard Certification

 

Application
  1. CHEMICAL MECHANICAL POLISHING SLURRY
    • Slurry paticle size and composition analysis; partivle aggregation and dispersibility analysis, solving the problem in monitoring manufacturing process defects.
  2. METAL PLATING
    • In PCB manufacturing process,precipitation of heavy metal particles in degraded electroplating liquid causes abnormal end product . therefore , in-situ monitoring analysis is required.
  3. PAINT & COATING MATERIAL
    • Analysis of the actual particle distribution in the paint or coating suspension.
  4. SOLDER PASTE, THERMAL GREASE AND PACKAGING SILVER GLUE
    • Liquid manufacturing process analysis , exclude abnormality in the related pastes and silver glue in product manufacturing process.
Specification

Ultra-thin sample adaptive chips

Produced using the semi-conductor manufacturing process together with surface treatment, the membrane can be made hydrophobic, hydrophilic or bifunctional linkers for different applications, allowing samples under test to automatically adhere to the observation window for best image resolution. To ensure image quality, the membrane thickness is designed to be less than 30 nm, yet it is made robust by adjusting the window size and shape to withstand the pressure difference between the vacuum and atmosphere.

Electron microscope, aggregation, particle, nanometer, liquid electron microscope,

CLIIS offline flowing

Mars - Temperature control cell

In-situ precision temperature control during liquid phase

Temperature flow cell

Main features
  1. Precision : Temperature stability is achieved with a precise and stable temperature control within ± 0.02 ℃.
  2. Two-way Temperature Control : 0 Capable of simultaneously raising or lowering the temperature between 10 to 100 ℃, it is allowed to customize temperature control as well.
  3. High Compatibility: High compatibility with various models ( FEI   JEOL  Hitachi ZEISS Phenom TSCAN TEMIC … )
Standard Certification

 

Application
  1. CHEMICAL MECHANICAL POLISHING SLURRY
    • Slurry paticle size and composition analysis; partivle aggregation and dispersibility analysis, solving the problem in monitoring manufacturing process defects.
  2. METAL PLATING
    • In PCB manufacturing process,precipitation of heavy metal particles in degraded electroplating liquid causes abnormal end product . therefore , in-situ monitoring analysis is required.
  3. PAINT & COATING MATERIAL
    • Analysis of the actual particle distribution in the paint or coating suspension.
  4. SOLDER PASTE, THERMAL GREASE AND PACKAGING SILVER GLUE
    • Liquid manufacturing process analysis , exclude abnormality in the related pastes and silver glue in product manufacturing process.

Observe the Electrization and Electron Transfer on Material Interface

Main features
  1. Multi-functional : Simultaneously perform fluid transmission, temperature control, and electric current control to satisfy users’ needs during complex experiments.
  2. Flexible : Users can place any battery pole piece onto our well-designed holder to conduct inspection experiment.
  3. Simple : We have designed the most complex electrode, circuit, and pin in the inner part of our holder. Users only need to place the to-be-observed sample and liquid inside the holder, and it will be completed within five minutes.
Standard Certification

 

Application

Venus is a quick assembly version of electrode testing.
We provide electrical charging/ discharging as well as micro-environment control for liquid samples.
Venus is conducted with MFC system via correlative data from electron optical platform (electron microscope).
The electrical charging/discharging can also be transmitted to the control system and inside the microfluidics via pogo pin design.
Applications in testing the quality of coating material used in the electronic industry include the electro-conductive paste (silver/aluminum paste) of solar batteries.
Venus revolutionizes the R&D of the manufacturers and users of the electro-conductive paste. As well as the outgoing, incoming and in-process quality control of the paste.

FlowVIEWTek-Flowview-Venus

Flow AOI

We provide Flow-AOI total solution, assisting you to improve production yields, save manpower and time, enhance quality and manufacture process fluency.

Main features
  1. Optical Customization Service : The electron beam detection of liquid samples is performed in a vacuum environment to create an atmospheric environment. Through nano-visualization stages and microfluidic wafers, we help customers perform a variety of liquid sample high-resolution detection.
  2. Fluid system integration : Customized service for fluid system control and integration
  3. Sensing and measuring : Fluid-related sensing elements and calibration services
  4. Software analysis : Image recognition and analysis software
  5. Automation : Fully automated analysis and customized services
Standard Certification

 

Application

Particle Analysis System (Online / Lab) (Micron / Nano)
. Scatter / gather
. Size / size distribution
. Surface area
. shape
. Composition
. Polymer material analysis
Microbial analysis identification system
. Wastewater treatment testing
. Reservoir water quality test 

Content changed at :2023-08-28 17:41:08
  • 繁體中文

TME

TM Electronics has been in the business of manufacturing measuring instruments for over 60 years. We’ve spent that time inventing brilliant devices that can improve both the quality and productivity of your processes. 
We started out in the metal fabrication industry where we specialized for 20 years. In the early eighties we saw an opportunity to create medical devices and expand our measuring device portfolio. Thankfully, we grasped it and the move broadened our horizons. Soon the innovative minds of our engineers were imagining new devices to improve the automotive, electronics, pharmaceutical, and food manufacturing markets. 
Now we manufacture the best in automated, high technology leak testers, leak and flow testers, and package testers.

TME Integra Flex

TME’s Integra Flex instruments offer you an affordable method of leak testing that is perfect for different testing environments. You can configure the industrial rack-mount model for easy integration into OEM operations, data , and connectivity tools. The benchtop model is perfect for smaller production environments and R&D applications.

Main features
  • Easy LAN connectivity
  • Rack mountable
  • Standard XML data format
  • Compact size
  • Remote control options for factory integration
  • PLC controls and I/O for user operations
  • Easy integration into Quality Control tools and I.O.T systems
Standard Certification

 

Application
  • Applications: Leak Testing
  • Industries: Beverage, Flexible Packaging, Food
Specification

Integra Flex 01 Pressure Range:  0-100 psig
Integra Flex 01 accuracy:  ± 0.5 psi
Integra Flex 02 Pressure Range:  -14.7 to +15 psig
Integra Flex 02 accuracy:  ± 0.15 psi
Integra Flex 03 Pressure Range:  ATM to -14.7 psi vacuum
Integra Flex 03 accuracy:  ± 0.1 psi
Resolution: 0.0001 psi
Mains Power:  Desktop 12 vdc Industrial 24 vdc
Test port fitting:  1/8” FNPT
Interface Communications/Connectivity:  Ethernet TCP/IP, RS232, I/O (8I/O)
HMI:  8” Touchscreen accessory
Regulator:  Manual Regulator

LT-V/L_TME WORKER Integra

The smart TME WORKER Integra is an intelligent instrument making programming, testing, downloading, printing, storing, accessing, reviewing test results much easier than it has been done in the past.

Main features
  • High resolution (0.0001 psi)
  • The small internal volume contributes to high sensitivity, repeatability, and reliability.
  • The Icon-Based Touchscreen Color Display allows the operator to control the test parameters, examine statistical analysis of results or download data files easily.
  • USB Connection to a PC
  • USB ports for keyboard, Mouse, Printer or bar code reader
  • LAN remote instrument control, data transfer, and operation
  • Optional electronic regulator available
  • The smart TME WORKER Integra is an intelligent instrument making programming, testing, downloading, printing, storing, accessing, reviewing test results much easier than it has been done in the past.
Standard Certification

ASTM D4991
ASTM D5094
ASTM F2095
ASTM F2096
F-1140
F-2054
FDA CFR 21 part 11
IEC 60529 (IP67 Equivalency testing)
ISO 11607

Application
  • Applications:Creep to Fail Testing, Integrity Testing, Leak Testing
  • Industries:Aerospace, Automotive, Defense, Electronics, Flexible Packaging, Food, Industrial, Medical Devices, Pharmaceutical
Specification

Small Footprint: 10"Wx10"Dx9"H
Security Controls: Key Lock
Display: 5.7” QVGA Color Touchscreen
Pressure Control: Manual or Electronic
Units: Psig, InH2O, mBar, kPa, inHg, ccm, LPM, cfm
Test Modes: Leak, Flow, Occlusion
Memory Capacity: 128 Mbytes (Expandable up to 512Mb)
LAN (Network):  Web-browser & more
Test Modes: Leak, Occlusion, Flow
Range (PSIG):  -13.5 to 150
Resolution (PSIG):  0.0001 (-13,5 to 150)
Pressure Accuracy:  +/- 0.5% FSD
Repeatability (6 sigma/FSD):  <1%
Flow Ranges (SCCM): up to 10.000
Flow Accuracy: +/- 2% FSD

PA-2096 TME Pressure Bubble Tester

The TM Electronics TME Pressure Bubble Tester provides low pressure and controlled flow to a pouch to meet the requirements of ASTM International F-2096 test method “Standard Test Method for Detecting Gross Leaks in Packaging by Internal Pressurization Bubble Test”.

Main features
  • Meets ASTM F-2096 Standards
  • Simple set up
  • Open screen retainer provides high visibility from all sides
  • Retainer is locked in position to hold the pouch underwater
  • Digital pressure readings – multiple units of measure with backlighted display
  • Low pressure control 2" H2O
  • NIST traceable gauge calibration
Standard Certification

ASTM D5094
ASTM F2096

Application
  • Applications: Creep to Fail Testing, Integrity Testing, Leak Testing
  • Industries: Aerospace, Automotive, Defense, Electronics, Flexible Packaging, Food, Industrial, Medical Devices,  Pharmaceutical
Specification

Control box:  Low Pressure Regulator
Bubble Testing: ASTM F2096
Pressure levels: 0.1 to 5 PSIG

BT-IP BT Integra Pack: Smart Package Tester

TME Smart BT Integra-Pack-Package Tester for Burst Tests, Creep Tests, Creep-to-Failure Tests, and Leak Integrity Tests

Main features
  • A bench-top, high-resolution (0.001 psig) test instrument
  • A small footprint and user-friendly ease of operation
  • Electronic pressure and flow controls provide precise and repeatable test conditions
  • Automatic and high flow output allow testing of large porous packages
  • Applications cover a range of flexible or rigid, porous and non-porous, open or sealed packages.
  • Complies with standards for all commonly-used Seal Strength and Package Integrity tests (Burst, Creep, Creep-to-Failure, and Leak Integrity)
  • Automatic Burst Test Mode
  • Results right out of the box, no lengthy setup
  • Senses package size during prefill
  • Manual Burst Test Mode
  • Multiple levels of control for optimal test results – Ramp Rate, Porous vs. Non-Porous Packages, Max/Min Acceptance Limits, Pressure Drop Sensitivity
  • High Performance
  • Advanced, user-defined smart interface compatible with USB keyboards, mice, bar code readers
  • Low Power Stand-by Mode for energy conservation
  • Graphical test plot display for leak, burst and creep tests
  • Test data exporting to PC using Flash Driv
Standard Certification

ASTM F2095
ASTM F2096
F-1140
F-2054
FDA CFR 21 part 11
ISO 11607

Application
  • Applications:Burst Testing, Creep to Fail Testing, Leak Testing, Strength Testing
  • Industries:Flexible Packaging, Food, Medical Devices, Pharmaceutical
Specification

Resolution:  Higher Pressure Resolution (0.01 psi burst, 0.001 leak)
Regulator:  Automatic Regulator (fast pressure setting)
Flow capacity:  High Flow Capacity (up to 15 CFM)
Pressure:  Low Pressure Sensitivity at 5 InH2O
Display:  High Resolution Color LCD Display with Touchscreen
Metric units:  Standard and Metric units

Content changed at :2024-01-11 10:38:00
  • 繁體中文

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