Advanced Energy and Scientech Corporation will take a new journey and create brilliant new achievements together.
Happy Birthday to Advanced Energy!
Advanced Energy與辛耘企業將一起踏上新征程，共創輝煌新成就
祝AE生日快樂！
Advanced Energy與辛耘企業將一起踏上新征程，共創輝煌新成就
祝AE生日快樂！
Advanced Energy and Scientech Corporation will take a new journey and create brilliant new achievements together.
Happy Birthday to Advanced Energy!
半導體、面板、LED、太陽能製程設備所使用之無線射頻電源（RF電源）、匹配器（Matching Network）、直流、交流、超高電壓電源供應器及遠距電漿系統（RPS：Remote Plasma Source）及其維修服務。高溫計 AE-LumaSense Pyrometer UV400/UVR400 for MOCVD GaN on Sapphire, GaAs etc.
RF Generator, Matching Network, AC / DC Power Supply, Remote Plasma Sources (RPS), High Voltage Power Supply and Optical Fiber Thermometers for Dry Etch, CVD, PVD Ion Implanter Process Tool and its Repair Service. AE-LumaSense Pyrometer UV400/UVR400 for MOCVD GaN on Sapphire, GaAs etc.
2023年08月電子報
#ANNEALSYS化學氣相沉積設備 #PLASMA-THERM ® VERSALINE® 化學氣相沉積設備 #CORIAL蝕刻和沈積系統 #Advanced Energy 化學氣相沉積設備
化學氣相沉積（Chemical Vapor Deposition，簡稱CVD）是一種常見的薄膜成長技術，通常用於固體表面上製造具有特定性質和厚度的薄膜。使用化學氣相沉積設備的過程涉及將氣態前體化學物質輸送到基板表面，然後使其在基板表面上發生化學反應，形成所需的薄膜。這些前體物質可以是氣體或揮發性液體，並在高溫環境下進行反應。本文將深入探討化學氣相沉積(CVD)的運作原理、其優勢和限制，同時也會介紹相關的化學氣相沉積設備。
◉化學氣相沉積設備CVD的基本原理
化學氣相沉積設備的基本原理包括以下步驟：
◉化學氣相沉積設備CVD的優點
◉化學氣相沉積設備CVD的缺點
◉化學氣相沉積設備CVD的應用
化學氣相沉積設備（CVD）在多個領域廣泛應用，包括但不限於以下領域：
總結來說，CVD技術具有高度可控性和廣泛的應用領域，但它也面臨著製程複雜性和高溫要求等挑戰。隨著科技的不斷進步，CVD在材料科學和產業製造中仍然扮演著重要的角色，同時化學氣相沉積設備也在不斷演進與創新。
◉化學氣相沉積設備適用材料
化學氣相沉積（CVD）技術可以適用於多種不同的材料。以下是一些常見的CVD適用材料：
半導體材料：
矽（Silicon）：用於成長矽晶片、矽膜、矽氧化物等。
氮化鎵（Gallium Nitride，GaN）：用於製造高功率和高頻率的光電器件。
砷化鎵（Gallium Arsenide，GaAs）：常用於高速電子器件和光電元件。
磷化銦（Indium Phosphide，InP）：廣泛應用於光通信和光電器件。
金屬材料：
鈷（Cobalt）：用於製造硬質薄膜和磁性材料。
鈷合金（Cobalt Alloys）：用於高溫和耐磨應用，如氣輪機構件。
鉬（Molybdenum）：用於成長導熱膜、金屬薄膜等。
鉑（Platinum）：用於製造電極、催化劑和阻焊膠。
鈦（Titanium）：常用於生物醫學植入物、硬質薄膜等。
陶瓷材料：
氧化鋁（Aluminum Oxide，Al2O3）：用於製造陶瓷塗層、介電層等。
硝酸鋯（Zirconium Nitride，ZrN）：用於硬質塗層和保護層。
碳化矽（Silicon Carbide，SiC）：用於高溫和高壓應用，如車載電子器件。
碳化硼（Boron Carbide，B4C）：常用於防彈材料和硬質塗層。
光學材料：
二氧化矽（Silicon Dioxide，SiO2）：用於光學鍍膜和光學纖維。
氟化鋯（Zirconium Fluoride，ZrF4）：用於製造光學鍍膜和透鏡。
生物醫學材料：
鈣磷酸鹽（Calcium Phosphate）：用於骨植入物和牙科應用。
鈦合金：常用於製造人工骨骼和骨植入物。
以上僅列舉了一些常見的CVD適用材料，實際上，CVD技術能夠應用於眾多材料。由於CVD具有高度可控性和適應性，使其成為材料科學和工業製造領域中重要的技術之一。
Annealsys是快速熱處理(RTP)和化學氣相沉積(CVD/ALD)設備的領先製造商，用於矽和化合物半導體、奈米技術、MEMS、太陽能電池、玻璃等領域的研究生產應用。
快速升溫製程(RTP) / 快速熱化學氣相沉積（RTCVD）
化合物半導體應用附有自動上貨系統的量產工具。微機電，傳感器，發光二極管，雷射二極管，光電子，通訊元件，功率和離散元件，微型電池，奈米科技等。
直接液體注入化學氣相沉積（DLI-CVD）/ 直接液體注入原子層沉積（DLI-ALD）
沉積新元素週期表材料最有效的技術。半導體，微型電池，物體內波及聲表面波濾波器，高溫及耐蝕障壁，生物相容層等。多元金屬氧化物，2D材料 氮化物，金屬與合金等。
沉積材料舉例: LiNbO3, LaNiO3, SrTiO3, BaO, Y2O3, Cr2O3, TiO2, Al2O3, HfO2, Bi2O3, Co3O4, CuCrO2, SiO2, TiN, AlN, Pt, MoS2 …
PLASMA-THERM ® VERSALINE® 化學氣相沉積設備
辛耘企業擁有PLASMA-THERM ®在台灣及中國的獨家代理權。PLASMA-THERM ®是一家總部設在美國的半導體設備生產商，為全球電漿蝕刻和薄膜沉積設備的領導廠商，在等離子工藝技術創新的37個專利。
CORIAL是PLASMA-THERM ®集團旗下的一家公司，提供LED、微機電（MEMS）、化合物半導體（GaAs, GaN, InP,…）、功率半導體之薄膜（Thin Film）及乾蝕刻（Dry Etch）設備。
高通量蝕刻和沈積工具，可批量裝載，適用於最大 200~300 毫米的晶圓加工。
CORIAL 200 系列開發的工藝配方為廣泛的市場提供蝕刻和沈積解決方案，包括故障分析、微機電系統 (MEMS)、光電子、先進封裝、無線設備和功率半導體。CORIAL 300 系列系統非常適合光電子、MEMS、光掩模和功率半導體市場的批量生產薄膜蝕刻和沈積。
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◎
◎ ICP-CVD
用於乾法蝕刻、化學氣相沉積(CVD)、物理氣相沉積(PVD) 離子注入機工藝工具及其維修服務的射頻發生器、匹配網絡、AC/DC 電源、遠程等離子體源 (RPS)、高壓電源和光纖溫度計。 AE-LumaSense 高溫計 UV400/UVR400，可用於金屬有機化學氣相沈積(metal organic CVD, MOCVD)。
December 2022 Press Release
With the rapid development of the electronics industry, new applications such as AR, IoT, and HPC demand more and more advanced technology. In order to achieve smaller feature size, energy saving, high efficiency and low cost, the complexities of design and process increase significantly for each technology nodes, and then slowing down the Moore's Law. Therefore, the adoption of heterogeneous stack packaging technology will become crucial for Moore's Law continuity.
Being a leading semiconductor equipment and wafer reclaim supplier in Taiwan, Scientech Corporation has launched the development of wet process equipment in 2003. Scientech has successively supported customers in LED, Mini/Micro LED, compound semi and power components such as IGBT, SiC and GaN industries, as well as advanced packaging process such as Bumping, Fan-out, Chip-On-Wafer and so on. Our wet process equipment has been successfully verified in the latest Chiplet's 2.5D/3D packaging process technology and smoothly introduced into mass production.
Scientech wet process equipment with single-wafer and wet-bench type, can be highly customized to adapt new process flow and operational interface. The ability to customize operational interface, hardware and software design to satisfy customer demands for advanced packaging technology is one of our competitive advantages.
Over the years, Scientech wet process equipment for advanced technology has been continued to improve its production efficiency, cost reduction and carbon footprint to achieve sustainable business goals. Being a leading equipment supplier and service provider at various industries, with global support capability, Scientech commits to provide the best to every customer in which we serve.
If you have any further questions, please feel free to contact us by using Line or Email.
E-mail: info@scientech.com.tw
All the best!
Scientech to Add PulseForge Photonic Digital Thermal Processing to Semiconductor Product Portfolio
Austin, Texas – 1st August 2023 – PulseForge, Inc. and Scientech have announced a collaboration to integrate Digital Thermal Processing into Scientech's semiconductor equipment portfolio. Scientech, Taiwan's leading semiconductor equipment distributor and manufacturer known for its precision solutions, aims to enhance its product offerings with this advanced photonic thermal solution.
PulseForge, renowned for its expertise in applied thermal energy, brings unique soldering, curing, and sintering technologies to the partnership. The addition of photonic digital thermal processing complements Scientech's portfolio and is expected to bring added value to its customers.
The adoption of photonic soldering, curing, and sintering technologies is gaining momentum as industries seek more precise, efficient, and environmentally friendly manufacturing processes. These techniques offer the potential for better energy control, faster production speeds, and reduced waste compared to traditional methods.
Jonathan Gibson, CEO of PulseForge, expressed excitement about working with Scientech, expressing confidence that this partnership will yield strong results for Scientech's customers in Asia and worldwide. Collaborations with Scientech and PulseForge are expected to play a crucial role in meeting the growing demand for high-performing chips.
According to Scientech, the timing is opportune for introducing the new integrated photonic digital thermal processing approach as it aligns perfectly with the growing trends of 2.5D / 3D IC in the semiconductor industry. This innovative solution is expected to play a crucial role in supporting these advanced packaging technologies, leading to notable improvements in product quality and satisfying the increasing market demand.
As these photonic technologies advance and become more accessible, various industries can benefit significantly from their implementation. Areas such as electronics manufacturing, automotive, aerospace, medical devices, and even renewable energy can leverage these technologies to enhance their production capabilities, improve product quality, and decrease overall costs. Collaboration with PulseForge reinforces Scientech's commitment to providing cutting-edge solutions and solidifies its position as a leading player in the semiconductor equipment market
About PulseForge, Inc.
PulseForge utilizes applied energy in a precise and targeted manner to enable innovation in industrial manufacturing. Our expertise and tools empower our customers to explore novel materials and manufacturing methodologies, driving dynamic and efficient production at an industrial scale. Learn more at www.pulseforge.com
About Scientech
Scientech is a well-established Taiwan-based semiconductor equipment merchandiser with over 40 years of experience, including over 15 years of expertise in developing and manufacturing precision packaging equipment. Scientech offers a diverse range of merchandising products for semiconductors' Front-End-of-Line (FEOL) and Back-End-of-Line (BEOL) processes, flat panel displays, LEDs, data storage, scientific inspection instruments, optoelectronic, and analytical instruments.
Furthermore, Scientech's in-house equipment manufacturing unit produces wet process tools in both single and batch modules. These tools serve various applications, including cleaning (pre, post, mid), etching (metal, UBM), striping (PR), developing, and plating (electro, electro-less), for semiconductor and LED/Micro LED processes. Additionally, Scientech offers temporary bonding-debonding equipment for advanced packaging applications and wafer support systems, meeting the diverse needs of the semiconductor industry. https://www.scientech.com.tw
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PulseForge, Inc. |
Scientech Corporation |
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Eric Lee (President, Sales Group) |
Scientech to Add PulseForge Photonic Digital Thermal Processing to Semiconductor Product Portfolio
Austin, Texas – 1st August 2023 – PulseForge, Inc. and Scientech have announced a collaboration to integrate Digital Thermal Processing into Scientech's semiconductor equipment portfolio. Scientech, Taiwan's leading semiconductor equipment distributor and manufacturer known for its precision solutions, aims to enhance its product offerings with this advanced photonic thermal solution.
PulseForge, renowned for its expertise in applied thermal energy, brings unique soldering, curing, and sintering technologies to the partnership. The addition of photonic digital thermal processing complements Scientech's portfolio and is expected to bring added value to its customers.
The adoption of photonic soldering, curing, and sintering technologies is gaining momentum as industries seek more precise, efficient, and environmentally friendly manufacturing processes. These techniques offer the potential for better energy control, faster production speeds, and reduced waste compared to traditional methods.
Jonathan Gibson, CEO of PulseForge, expressed excitement about working with Scientech, expressing confidence that this partnership will yield strong results for Scientech's customers in Asia and worldwide. Collaborations with Scientech and PulseForge are expected to play a crucial role in meeting the growing demand for high-performing chips.
According to Scientech, the timing is opportune for introducing the new integrated photonic digital thermal processing approach as it aligns perfectly with the growing trends of 2.5D / 3D IC in the semiconductor industry. This innovative solution is expected to play a crucial role in supporting these advanced packaging technologies, leading to notable improvements in product quality and satisfying the increasing market demand.
As these photonic technologies advance and become more accessible, various industries can benefit significantly from their implementation. Areas such as electronics manufacturing, automotive, aerospace, medical devices, and even renewable energy can leverage these technologies to enhance their production capabilities, improve product quality, and decrease overall costs. Collaboration with PulseForge reinforces Scientech's commitment to providing cutting-edge solutions and solidifies its position as a leading player in the semiconductor equipment market
About PulseForge, Inc.
PulseForge utilizes applied energy in a precise and targeted manner to enable innovation in industrial manufacturing. Our expertise and tools empower our customers to explore novel materials and manufacturing methodologies, driving dynamic and efficient production at an industrial scale. Learn more at www.pulseforge.com
About Scientech
Scientech is a well-established Taiwan-based semiconductor equipment merchandiser with over 40 years of experience, including over 15 years of expertise in developing and manufacturing precision packaging equipment. Scientech offers a diverse range of merchandising products for semiconductors' Front-End-of-Line (FEOL) and Back-End-of-Line (BEOL) processes, flat panel displays, LEDs, data storage, scientific inspection instruments, optoelectronic, and analytical instruments.
Furthermore, Scientech's in-house equipment manufacturing unit produces wet process tools in both single and batch modules. These tools serve various applications, including cleaning (pre, post, mid), etching (metal, UBM), striping (PR), developing, and plating (electro, electro-less), for semiconductor and LED/Micro LED processes. Additionally, Scientech offers temporary bonding-debonding equipment for advanced packaging applications and wafer support systems, meeting the diverse needs of the semiconductor industry. https://www.scientech.com.tw
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PulseForge, Inc. |
Scientech Corporation |
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Jaimie Mauvais |
Eric Lee (President, Sales Group) |
本公司提供對於所代理機器設備或非代理機器設備關鍵零組件翻修，亦可與User合作開發。
2-1本公司代理Kensington公司Robot銷售及維修業務，請參考 Kensington
2-2本公司代理Nidec-Genmark 公司Robot銷售及維修業務，請參考 Nidec-Genmark
3-1本公司代理Dynatronix公司Power 銷售及維修業務，請參考 Dynatronix
3-2本公司代理Advanced Energy (AE) 公司Power 銷售及維修業務，請參考 Advanced Energy (AE)
Scientech supplies all kinds of the key components repairing. Even with the equipments we are not distributing, we also can collaboration and develop with customer.
2-1 Scientech represents Kensington. For Kensington robot sale and repair, please refer to : Kensington automation
2-2 Scientech represents Nidec-Genmark. For Nidec-Genmark robot sale and repair, please refer to : Nidec-Genmark automation
3-1 Scientech represents Dynatronix. For Dynatronix power sale and repair, please refer to : Dynatronix power
3-2 Scientech represents Advanced Energy (AE). For AE power sale and repair, please refer to : Advanced Energy (AE)
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