Napra

Napra succeeded in the development and manufacturing of the homogeneous fine alloys particles with nano-composite structure, for the first time in the world.
Brand new function of Napra patented fine alloy particles provide break-through solutions for the manufacturing of semiconductor devices and other cutting edge fine electronic components.

IMC joint material

Napra advanced joint materials (IMC sheet/paste) is Cu-Sn-Ni metal alloy joint material, which is using on die and substrate attachment, and it could also be uased as TIM and Die bonding material. 

Main features
  • Lower Cost than existing materials and solutions, such as Ag sintering, Cu sintering.
  • High Temperature Operation by Low Temperature Processing (ex> high power device)
  • Good reliability (TCT, HTSL, die shear strength and etc.) 
  • Suitable for wide area joint with less voids
  • Avoid voids, delamination, and crack production.
Application
  • High power device, such as IGBT systems, SiC/GaN/GaO systems and Si-based power semiconductor.
  • as TIM1 material.

 

 

Content changed at :2023-08-28 17:11:32
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