SANYOSEIKO

SANYOSEIKO.CO.,LTD started operations in 1963, developed and started selling "SMT Scope" in 1999. Has a number of patents "high temperature observation device", "solder paste wettability evaluation device and method", etc. In recent years, we have provided various gas environment heating equipment required by customers.

High temperature observation equipment

高溫觀測裝置SMT Scope

The high temperature observation SMT Scope provides real-time observation of materials as they change under high temperatures, from room temperature up to 900℃.

Main Features
  • Precise and repeatable temperature control
  • Various heating atmospheres
  • High-magnification observation without fluctuation
  • Equipped with image analysis and video editing capability
  • Wettability test of JIS standard
Standard Certification

JIS Z 3284-4 4.5 displacement detecting wettability test, which is a wettability evaluation method for solder paste. 
JIS Z 3285 5.5 high temperature observation test, which is a characteristic test method of solder paste for fine bonding.

Application

Electronic equipment manufacturing, automobile manufacturing, electronic parts manufacturing, material manufacturing, and research fields.

Specification
  • In addition to atmospheric and nitrogen atmosphere heating, it is possible to control the oxygen concentration in a nitrogen atmosphere. Besides the handling of formic acid, hydrogen, forming gas and high vacuum, dew point and oxygen concentration adjustment is available as well.
  • It can be varied from 0.078 to 20.0 times optically, and even fine powders of solder paste can be observed. Sample fumes and organic substance which has become gas will be eliminated by flowing the atmospheric gas in the chamber and degradation of image quality due to the fluctuations can be prevented, which will lead to high-quality images.
  • The recorded video can be edited speedily by editing software. The length, angle and area of the still images cut out from the playback screen can be measured by the measurement software
Content changed at :2023-08-28 17:13:11