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EnglishMueTec
MueTec provides a comprehensive range of automated optical inspection (AOI) systems for various applications in the wafer and photomask industry, including CD (Critical Dimension) and Overlay Metrology, Defect Inspection, Defect Review and Film Thickness Measurement. These defect inspection and metrology equipment solutions are designed to support fabs expedite their development and production ramp cycles, to achieve higher semiconductor die yields and to improve return on invest.
DaVinci 270UV
MueTec's has a large, global installed base of optical CD (Critical Dimension) mask metrology systems. These systems were sold under the “LWM270UV” brand name by Leica and KLA in the past. The latest member of this product family is the DaVinci 270UV, a fully enclosed, fully automated mask metrology system.
Main features
- Cost effective solution for mask layers with feature sizes of 300nm and above
- UV and visable light capability
- Reflected and transmitted light
- Highest quality opticcs
- Flexible tool configurations available
- CD repeatability (3 sigma) long term < 4 nm (etched layer)
Standard Certification
Application
- Mask Critical Dimension Metrology
Specification
DaVinci 200 (CD, OVL, IR)
MueTec’s Infrared-Solutions are designed to improve manufacturing yield in MEMS manufacturing. We offer fully automated solutions for 100 mm, 150 mm, 200 mm and 300 mm MEMS wafer.
Main features
- Best inclassIR image quality with wafelengths of up to 1500nm
- Flexible handling (backside vacuum, flipping, edge-vacuum) for MEMS specific wafers
- Combined reflected & transmitted light illumination modes
Standard Certification
Application
CD:
• CD measurement
• Line Edge Roughness (LER)
• Pattern measurement
• Shading correction
OVL:
• Box in box
• Frame in frame
• L-bars
• Circle in circle
• Customized overlay features
IR:
• Sealing Inspection after bonding
(eutectic bonding or glass frit bonding)
• Device Inspection after bonding
• Overlay Metrology after bonding
• Critical Dimension Metrology after bonding
Specification
Argos 200
MueTec’s Macro Defect Inspection products are designed for customers with many diff erent wafer types. The system is easy to operate and does not require to write any recipes. It also enables 100% inspection of all wafer during the process of lithography with a throughput that is equal to, or faster that of a lithography cluster. We enable our customers to move from sample inspection to inspection of all wafer and from manual inspection by operators to a statistically reliable, automated inspection process.
Main features
- Simultaneous bright- and darkfield front and backside inspection
- Unique, optimized wafer handling for a throughput 200 wafer per hour
- No recipe required for ease of use
Standard Certification
Application
- Defect Inspection
- bright- and darkfield front and backside inspection
Specification