Scientech Corporation  

Chemistry and Biotechnology
Broadcast Equipment
Semiconductor III-V Group
PCB Industry
Packaging & Testing
arrow2 ATEN
arrow2 Deringer-Ney
arrow2 Dynatronix
arrow2 FRT
arrow2 Genmark
arrow2 Kensington
arrow2 Kingsemi
arrow2 KLA
arrow2 M Napra
arrow2 Neutronix Quintel
arrow2 Plasma-Therm
arrow2 TMC
arrow2 TOHO
arrow2 UCP
arrow2 VLSI
arrow2 YES
arrow2 Zeiss
Used Tool
Scientech Tool
3D Printer
  Packaging & Testing - Plasma-Therm - RIE / ICP Etcher (Manual Vision Series / ICP / DSE / RIE-Load Lock)

RIE / ICP Etcher (Manual Vision Series / ICP / DSE / RIE-Load Lock)
icon  icon
Main Features:
Plasma Etching or Dry Etching is a plasma based process that facilitates the removal of material from the surface of a substrate. Typically, plasma processing of semiconductor materials is performed in a vacuum environment. The key to dry etching is the creation of reactive species within the plasma that can react with the material on the substrate with the formation of forming volatile reaction byproducts. Dry etching processes are often broken into four mechanisms which must be understood for effective etch system design.
icon Formation of active gas species.
icon Transport of the active species to the surface.
icon Reaction at the surface.
icon Pump down of the reaction products.
Types of Etcher:
icon Versaline Series
Semi-auto / Automatic RIE and ICP:
━RIE with Load Lock.
━ICP with Load Lock or Cassette.
━DSE with Load Lock or Cassette.
Vision Series:
━Manual RIE
Standard Certification:
icon ISO 9001
icon Plasma-Therm products and technologies serve a broad range of markets, including:
━Solid-state lighting
━Renewable energy
━Data storage
━Mid-End-of-Line packaging
Copyright © 2009 SCIENTECH. All rights reserved. Site map