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  Packaging & Testing - Deringer-Ney



Deringer-Ney produces several palladium and gold-based alloys used widely in wafer and package test probes, including buckling beam, cantilever probes, and pogo pins and sockets.
These alloys are palladium based and tarnish resistant. They do not require plating. This provides increased reliability over plated probes. Most are hardenable through heat treatment.

Detail
icon Cantilever Needle
icon Cobra Needle
icon Wire Needle
Contact:Joe Chen
Phone :+886-3-516-5177 Ext: 8263
Mobile:+886-987-238-607
E-Mail: joe.chen@scientech.com.tw
 
 
 
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