Scientech Corporation  

Chemistry and Biotechnology
Broadcast Equipment
Semiconductor III-V Group
arrow2 AE
arrow2 ATEN
arrow2 Dawonsys
arrow2 FRT
arrow2 hfsemi
arrow2 Kensington
arrow2 Kingsemi
arrow2 KLA
arrow2 Micro Image
arrow2 Nanonex
arrow2 Neutronix Quintel
arrow2 OAI
arrow2 Plasma-Therm
arrow2 Rehm Thermal
arrow2 SiGlaz
arrow2 SMEE
arrow2 Tera
arrow2 TMC
arrow2 Toho
arrow2 Verity
arrow2 VLSI
arrow2 WI-A
arrow2 YES
PCB Industry
Packaging & Testing
Used Tool
Scientech Tool
3D Printer
  LCD - Dawonsys - Gun Type Plasma Jet Devic

Gun Type Plasma Jet Devic

Main Features:
icon 1.Special Exhaust System not Required due to Low Ozone Gas Emissions
2.Lower Arc Applied Voltage and Arc Holding Voltage
3.Lower Noise compared to others.
4.No Thermal Deformation or Thermal Damage through Low Temperature Plasma
5.Excellent Performance of Surface Reforming and Activation Compared to a Third-party Surface Reforming Device
6.Low Initial Investment and Operating Costs Compared to a Third-party Surface Reforming Device
7.Easy Installation and Maintenance
8.Possibility of Local Surface Reforming and 3D Shape Surface Reforming
Standard Certification:
icon Process prior to AOI Cleaning of TFT-LCD Module and Process prior to PAD Cleaning
1.ACF Bonding Process of TFT-LCD Module and Process prior to COG Bonding
2.Improvement of Surface Reforming and Adhesive Strength for the Edge of Optical Film
3.Process prior to Painting of Auto Parts and Improvement of Adhesive Strength
4.Removal Process of Carbon of FPCB (PCB)
5.Process prior to Die Etching of LED Package and Prior Process of Wire Bonding
6.Handy Type Table-top Surface Reforming Device
7.Alternate Device of Flux Process in the Soldering Process
8.Solar Battery Tab/ Stringer (Substitution of Flux Process)
Copyright © 2009 SCIENTECH. All rights reserved. Site map