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  Semiconductor III-V Group - KOSTEK Systems, Inc. - KOSTEK R-9000 Descum Series

KOSTEK R-9000 Descum Series
Main Features:
icon 1. Up to 6 separated process modules
2. Rydeen 9000 series achieve high throughput
    - R-9400 : Max. 240 [wph] (@ Process Time 30sec)
    - R-9600 : Over.360 [wph] (@ Process Time 30sec)
3. Balanced ICP plasma source makes good uniformity and stable process.
4. Easy convertible from/to 200mm and 300mm wafer
5. Descum processes : Photo Resist, PI, BCB and PBO
6. Transferring two wafers by one movement of ATM robot
7. Specially designed transfer module & load lock
Standard Certification:
icon 1. Within wafer uniformity : ≤ ±5.0 [%]
2. Wafer to wafer uniformity : ≤ ±3.0 [%]
3. Throughput : ≥ 360 [WPH]
4. Footprint ≒6.7 [m2]
icon Descum of photo resist, polyimide, BCB, and PBO in the bumping process.
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