Scientech Corporation  

Chemistry and Biotechnology
Broadcast Equipment
Semiconductor III-V Group
arrow2 ATEN
arrow2 Auros
arrow2 Bruker
arrow2 ClassOne
arrow2 Dawonsys
arrow2 E-SOL
arrow2 FRT
arrow2 hfsemi
arrow2 HPSP
arrow2 Genmark
arrow2 Kensington
arrow2 Kingsemi
arrow2 Kitec
arrow2 KLA
arrow2 Micro Image
arrow2 Microtome
arrow2 M Napra
arrow2 Muetec
arrow2 Nanonex
arrow2 Neutronix Quintel
arrow2 NGR
arrow2 Nova
arrow2 Piotech
arrow2 Plasma-Therm
arrow2 Scientech
arrow2 SEMES
arrow2 SiGlaz
arrow2 SMEE
arrow2 Tera
arrow2 TMC
arrow2 TOHO
arrow2 TOWA
arrow2 UCP
arrow2 Ulvac
arrow2 Ushio
arrow2 Verity
arrow2 VLSI
arrow2 YES
arrow2 Zeiss
PCB Industry
Packaging & Testing
Used Tool
Scientech Tool
3D Printer
  Semiconductor III-V Group - IMT Co.,Ltd - iClean300 Laser clean / Wafer Backside Cleaner

iClean300 Laser clean / Wafer Backside Cleaner
iClean300 provides a non-contacted wafer back side cleanning which carries high throughput and non destructive.
Full edge 10mm dry cleaning in 18 sec. including Bevel area cleaning.
Main Features:
icon The important advantages of Dry Cleaning are;
Very clean since it is dry process using no chemical.
Very fast process that guarantees high productivity.
Very safe process that produces no surface damage.
Very compact design that requires small footprint.
Very economical since the Cost of Ownership is very low.
Standard Certification:
icon Contamination removal using laser selective interaction of evaporation and thermo-elastic detachment
Copyright © 2009 SCIENTECH. All rights reserved. Site map