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  Semiconductor III-V Group - Plasma-Therm - Plasma Micro-Die-Singulation (MDS)

Plasma Micro-Die-Singulation (MDS)
Main Features:
On-tape plasma-based die singulation is a novel approach to die separation. It allows complete dicing of any thickness wafers, especially thin and ultra-thin, on industry-standard tape frames after grinding. The key to plasma dicing is the process selectivity, and handling and maintaining complete integrity of metal or plastic tape frames in a vacuum plasma-based reactor.
Simple process-flow integration
━Plasma dicing is done from the front side of wafers after backside grinding in case of thin and ultra thin wafers, maintaining the simple process flow used with saw dicing.
━Tape and frame integrity after plasma dicing allows for direct use of grip ring for tape expansion and pick-and-place operation with no additional steps.
Types of Systems:
icon MDS-100: For all wafer size up to 8" on 200mm frame
icon MDS-300: 8" and 12" on 300mm frame.
Standard Certification:
icon ISO 9001
icon Plasma-Dicing on Si, Ge and GaAs material for all industory
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