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  Semiconductor III-V Group - KLA - P-170 / HRP-260 Sytlus Profiler



Contact:Wayne Tseng
Phone :+886-3-516-5177 Ext: 8270
Mobile:+886-987-238-657
E-Mail: wayne.tseng@scientech.com.tw
Contact:Ray Hsieh
Phone :+886-3-516-5177 Ext: 8284
Mobile:+886-987-238-591
E-Mail:ray.hsieh@scientech.com.tw
P-170 Sytlus Profiler
p-170-stylus-profiler
The P-170 is a cassette-to-cassette profiler offering step height measurement capability for steps from a few nanometers to one millimeter, for production environments. The system supports 2D and 3D measurements of step heights, roughness, bow, and stress for scans up to 200mm without stitching. The P-170 has advanced pattern recognition algorithms, enhanced optics, and an advanced stage for robust performance and seamless recipe transportability between systems – a key requirement for a 24x7 production environment.
Main Features:
icon Step height: Nanometers to 1000µm
Low force with constant force control: 0.03 to 50mg
Scan full diameter of the sample without stitching
Video: 5MP high-resolution color camera
Arc correction: Removes error due to arc motion of the stylus
Software: Easy-to-use software interface
Production capability: Fully automated with sequencing, pattern recognition and SECS/GEM
Wafer handler: Automatically loads 75mm through 200mm opaque (e.g., silicon) and transparent (e.g., sapphire) samples
Standard Certification:
icon
Application:
icon Step Height: 2D and 3D step height
Texture: 2D and 3D roughness and waviness
Form: 2D and 3D bow and shape
Stress: 2D and 3D thin film stress
Defect Review: 2D and 3D defect surface topography
Specification:
icon Single or dual cassette for 75 - 200 mm wafers with opaque and transparent aligner
Full automation with pattern recognition, Feature Find, and GEM/SECS
Enhanced recipe transportability through improvements to pattern recognition and autofocus algorithms
Enhanced throughput for better productivity
200 mm scan length – no stitching required
Up to 1 mm Z-range for measuring steps from 5 nm to 1 mm with constant force
Constant force control 0.03 – 50 mg
Dual view optics – Top and side view
Apex 2D and 3D advanced surface analysis software
HRP-260 Sytlus Profiler
hrp-260-stylus-profiler
The HRP®-260 is a high-resolution, cassette-to-cassette stylus profiler offering step height measurement capability from a few nanometers to 300µm. The P-260 configuration supports 2D and 3D measurements of step heights, roughness, bow, and stress for scans up to 200mm without stitching. The HRP®-260 configuration offers the same capability as the P-260, plus a high-resolution stage that produces scanning results similar to an AFM. The HRP platform has advanced pattern recognition algorithms that enhance recipe transportability between systems, a key requirement for a 24x7 production environments.
Main Features:
icon Step Height: Nanometers to 327µm
Low Force with constant force control: 0.03 to 50mg
Scan full diameter of the sample without stitching
Video: In-line low and high magnification optics
Arc Correction: Removes error due to arc motion of the stylus
Software: Easy-to-use software interface
Production Capability: Fully automated with sequencing, pattern recognition, and SECS/GEM
Wafer Handler: Automatically loads 75mm through 200mm opaque (e.g., silicon) and transparent (e.g., sapphire) samples
HRP: High-resolution scanning stage with resolution similar to an AFM
Standard Certification:
icon
Application:
icon Step Height: 2D and 3D step height
Texture: 2D and 3D roughness and waviness
Form: 2D and 3D bow and shape
Stress: 2D and 3D thin film stress
Defect Review: 2D and 3D defect surface topography
Specification:
icon 200 mm scan length standard (P-260) – no stitching
90 x 90 μm high resolution scanning (HRP-260)
Diamond stylus: 20 nm radius (or larger)
Up to 327 μm Z-range
Constant force control 0.03 – 50 mg
Fully automated operation for 75, 100, 125, 150, and 200 mm wafers
20 WPH with 5-sites and deskew alignment
Enhanced recipe transportability through improvements to pattern recognition and new autolight algorithm
Full automation with pattern recognition, Feature Find, and GEM/SECS communication
 
 
 
 
 
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