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  Semiconductor III-V Group - KLA - Nano Indenter G200

Nano Indenter G200
Main Features:
icon – Electromagnetic actuator to achieve the high dynamic range in force and displacement
– Modular options for imaging scratches, high-temperature nanoindentation measurements, and dynamic testing
– Intuitive interface for quick test setup; testing parameters can be changed with just a few mouse clicks
– Real-time experimental control, easy test protocol development and precise thermal drift compensation
– Award-winning, high-speed Express Test option to measure hardness and modulus
– Versatile imaging capabilities, survey scanning, and streamlined test method development for rapid results
– Simple determination of indenter area function and load frame stiffness
Standard Certification:
icon ISO14577
icon The Nano Indenter ® G200 system is an accurate, flexible, user-friendly instrument for nanoscale mechanical testing. The G200 measures Young��s modulus and hardness, including measurement of deformation over six orders of magnitude, from nanometers to millimeters. The system can also measure the complex modulus of polymers, gels and biological tissue as well as the creep response (strain rate sensitivity) of thin metallic films. Modular options can accommodate a variety of applications: frequency-specific testing, quantitative scratch and wear testing, integrated probe-based imaging, high-temperature nanoindentation testing, expanded load capacity up to 10N and custom test protocols.
– Semiconductor, thin films, MEMS (wafer applications)
– Hard coatings, including diamond-like carbon (DLC) films
– Composite materials, fibers, polymers
– Metals, ceramics
– Lead-free solder
– Biomaterials, biological and artificial tissue
icon Displacement measurement method: Capacitive displacement sensor
The total displacement range of the indenter: ≥ 1.5 mm
Maximum indentation depth: > 500 um
Displacement resolution: 0.01 nm
Loading mode: electromagnetic force
Maximum load (standard):>> 500 mN
Load resolution: 50 nN
High load option: 10 N/50 nN
DCM indentation option: 10 mN/1 nN
Frame stiffness: ≥ 5 x 106 N/m
Effective use area: 100 mm X 100 mm
Positioning accuracy: 1 um
Positioning control mode: Fully automatic remote control
Total magnification: 250x and 1000x
Objective lens: 10 X and 40 X
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