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  Semiconductor III-V Group - KLA - Nanoindenter / Tensile Tester



Contact:Ray Hsieh
Phone :+886-3-516-5177 Ext: 8284
Mobile:+886-987-238-591
E-Mail:ray.hsieh@scientech.com.tw
Contact:Wayne Tseng
Phone :+886-3-516-5177 Ext: 8270
Mobile:+886-987-238-657
E-Mail: wayne.tseng@scientech.com.tw

KLA Corporation (formerly KLA-Tencor Corporation) is a global capital equipment company based in Milpitas, California. It supplies process control and yield management systems for the semiconductor industry and other related nanoelectronics industries. The company's products and services are intended for all phases of wafer, reticle, integrated circuit (IC) and packaging production, from research and development to final volume manufacturing. KLA’s products and services are used by bare wafer, IC, reticle and disk manufacturers around the world. Products and services include inline unpatterned and patterned wafer defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions; wafer shape and stress metrology; computational lithography tools; and, overall yield and fab-wide data management and analysis systems.

iNano® (Nanoindenter)
Main Features:
icon The iNano® nanoindenter makes measuring thin films, coatings and small volumes of material easy. The accurate, flexible, user-friendly instrument can perform a wide range of nanoscale mechanical tests including indentation, hardness, scratch and universal nanoscale testing. The large dynamic range of force and displacement measurements allow materials from soft polymers to metals to be tested with accuracy and repeatability. Modular options can accommodate a variety of applications: material property maps, frequency-specific testing, scratch and wear testing and high-temperature testing. The iNano has a complete suite of options to expand testing, including sample heating, continuous stiffness measurement, NanoBlitz3D/4D property mapping and the remote video option.
Standard Certification:
icon
Application:
icon Universities, research labs and institutes
Semiconductor and packaging industry
Polymers and plastics
MEMS: Micro-electro-mechanical systems/nanoscale universal testing
Ceramics and glass
Metals and alloys
Pharmaceuticals
Coatings and paints
Polymer manufacturing
Composites
Batteries and energy storage
Specification:
icon Force Range Options: 50 mN
Typical Film Sample Thickness (Hard and soft films): Hard Film < 1 um, Soft film < 5 um
Displacement Range: ± 25 µm
X-Y Automated Stage Travel: 100 mm X 100 mm

iMicro (Nanoindenter)
Main Features:
icon The iMicro nanoindenter makes measuring hard coatings, thin films, and small volumes of material easy. The accurate, flexible, user-friendly instrument can perform a wide range of nanoscale mechanical tests including indentation, hardness, scratch and universal nanoscale testing. Interchangeable actuators provide a large dynamic range of force and displacement, allowing researchers to test materials from soft polymers to hard metals and ceramics with accuracy and repeatability. Modular options can accommodate a variety of applications: material property maps, frequency-specific testing, scratch and wear testing, and high-temperature testing. The iMicro has a complete suite of options to expand testing, including sample heating, continuous stiffness measurement, NanoBlitz3D/4D property mapping and the Gemini 2D force transducer, which enables tribology and other two-axis measurements.
Standard Certification:
icon
Application:
icon Universities, research labs and institutes
Semiconductor industry
PVD/CVD hard coatings (DLC, TiN)
MEMS: Micro-electro-mechanical systems/nanoscale universal testing
Ceramics and glass
Metals and alloys
Pharmaceuticals
Coatings and paints
Composites
Batteries and energy storage
Automotive and aerospace
Specification:
icon Force Range Options: 50 mN, 1 N
Typical Film Sample Thickness (Hard and soft films): Hard Film < 50 um, Soft film < 100 um
Displacement Range: ± 40 µm
X-Y Automated Stage Travel: 75 mm X 75 mm

Nano Indenter® G200 (Nanoindenter)
Main Features:
icon The Nano Indenter ® G200 system is an accurate, flexible, user-friendly instrument for nanoscale mechanical testing. The G200 measures Young’s modulus and hardness, including measurement of deformation over six orders of magnitude, from nanometers to millimeters. The system can also measure the complex modulus of polymers, gels and biological tissue as well as the creep response (strain rate sensitivity) of thin metallic films. Modular options can accommodate a variety of applications: frequency-specific testing, quantitative scratch and wear testing, integrated probe-based imaging, high-temperature nanoindentation testing, expanded load capacity up to 10N and custom test protocols.
Standard Certification:
icon
Application:
icon Universities, research labs and institutes
Semiconductor and electronics industry manufacturing
Tire industry
Coating and paint industry
Biomedical industry
Medical devices
Specification:
icon Indenter displacement range: ≥ 1.5 mm
Maximum indentation depth: > 500 um
Displacement resolution: 0.01 nm
Maximum load (standard): > 500 mN
Load resolution: 50 nN
High load option: 10 N/50 nN
DCM indentation option: 10 mN/1 nN
Frame stiffness: ≥ 5 x 106 N/m
Effective use area: 100 mm X 100 mm
Positioning accuracy: 1 um
Total magnification: 250 times and 1000 times
Objective lens: 10 X and 40 X

NanoFlip (Nanoindenter)
Main Features:
icon The NanoFlip nanoindenter measures hardness, modulus, yield strength, stiffness and other nanomechanical tests with high accuracy and precision under both vacuum and ambient conditions. In both scanning electron microscope (SEM) and focused ion beam (FIB) systems, the NanoFlip excels at tests, such as pillar compression, while synchronizing the SEM images with the mechanical test data. The NanoFlip performs fast measurements, which are key to testing heterogeneous materials in inert environments (e.g., glove boxes). The suite of options available, such as the InForce50 electromagnetic actuator, combine to deliver quantitative results that lead to valuable solutions in material research.
Standard Certification:
icon
Application:
icon Universities, research labs and institutes
Pillar and microsphere manufacturing
MEMS: Micro-electro-mechanical systems
Materials manufacturing (structure compression/tensile/fracture testing)
Battery and component manufacturing
Specification:
icon Maximum Load: 50mN
Typical Load Noise Floor: < 50nN
Displacement Time Constant: 20μs
Typical Displacement Noise Floor: < 0.25nm
Dynamic Excitation Frequency Range: 0.1 Hz to 1000 Hz
Maximum Data Acquisition Rate: 100 kHz
X/Y/Z Stage Sample Positioning Range: X: 20mm, Y: 20mm, Z: 25mm

InSEM® HT(High Temperature Nanoindenter)
Main Features:
icon The InSEM ® HT (high temperature) measures hardness, modulus and stiffness at high temperature by independently heating both the tip and sample in a vacuum environment. The InSEM ® HT is compatible with scanning electron microscope (SEM) and focused ion beam (FIB) chambers, or standalone vacuum chambers. The accompanying InView software helps advanced researchers develop novel experiments. Scientific publications show that InSEM ® HT results match well to traditional large-scale high temperature test data. The combination of wide temperature range capability and low cost of ownership makes the InSEM ® HT a valuable tool in materials development research programs.
Standard Certification:
icon
Application:
icon Universities, research labs and institutes
Aerospace
Automotive manufacturing
Hard coatings
Nuclear energy
Military/defense
Specification:
icon Maximum Load: 50mN (1000mN, optional)
Typical Noise: < 0.1nm
Displacement Range: 50 microns
Displacement resolution: 0.004nm
Load resolution: 3nN
Typical resonant frequency: 120 Hz
Typical indenter normal stiffness: 1000 N/m

T150 UTM (Tensile Tester)
Main Features:
icon The T150 UTM tensile tester measures the time-dependent response of strain rate-sensitive materials. It employs an electromagnetic transducer head to produce tensile force (load on sample) combined with a precise capacitive gauge to deliver high sensitivity over a large range of strain. It also lets users investigate tension/compression properties of biological materials using a dynamic characterization mode that permits accurate measurement at each point during testing.
Standard Certification:
icon
Application:
icon Universities, research labs and institutes
MEMS: Micro-electro-mechanical systems
Fibers and textile
Polymer thin films
Biomedical
Medical devices
Specification:
icon Maximum load: 500mN
Load resolution: 50nN
Maximum actuating transducer displacement: ±1mm
Displacement resolution: < 0.1nm
Dynamic displacement resolution: < 0.001nm
Maximum crosshead extension: 200mm
Extension resolution: 35nm
Extension rate: 0.5μm/s to 5mm/s
Dynamic frequency range (sample dependent): 0.1Hz to 2.5kHz

 
 
 
 
 
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