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  Packaging & Testing - Hanwha - SMF3 Flip-Chip Bonder



SMF3 Flip-Chip Bonder
SFM3 is HANWHA TECHWIN’s 3rd Generation Flip-Chip, FO-WLP/PLP Bonder that offers low cost of ownership at highest levels of accuracy.
Main Features:
icon 1. 100% FLUX INSPECTION CAPABILITY
2. Multi-Chip / Multi-Bin Function
3. Auto Nozzle Changer and Auto Nozzle Cleaner
4. 4-Camera System; Wafer, Teach, Up, Down Camera
5. Integrated with reflow system
6. Flip-Chip & 12” FO-WLP/PLP PLATFORM
Standard Certification:
icon 1. CONSISTENT HIGH ACCURACY, <5µm@3σ
2. FOWLP GLOBAL ACCURACY, < 10µm@3σ
3. STRIPS / BOAT / PANEL / C2W CAPABILITY for 12"x12"
4. HIGHEST THROUGHPUT IN CLASS 7.0K UPH
5. NO. OF BOND HEADS: 4
6. BOND FORCE:1N~30N
7. WAFER SIZE 8"/12", THIN DIE 40µm
Application:
icon 1. Flip Chip Bonder
2. Fan-Out Chip Bonder
3. 12" FO-WLP/PLP
Specification:
 
 
 
 
 
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