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  Packaging & Testing - Plasma-Therm - ME (Mask Etcher)



ME (Mask Etcher)
icon
Main Features:
Plasma-Therm has pioneered dry etching for the highly specialized photomask market for more than 15 years. Mask Etcher® systems set dry etch performance and flexibility standards for photomask production. Plasma-Therm’s Mask Etcher® solution is a key enabler of Moore’s law and shrinking technology nodes.
A wide variety of films can be etched from entry level 250um technology to < 32nm production with ICP high density plasma etch systems.
Excellent uniformity and particle control are achieved through innovative technologies while maintaining high system production uptime. Plasma-Therm’s latest Generation V Mask Etcher excels in CD uniformity and linearity well below 5 nm.
Hardware and Technology Node:
icon Mask Etcher Technology Node Dedicated platform specifically built for the highly specialized photomask market Several front-end handling options: - Ballroom/Bulkhead mounting - Automated load station (ALS) - SMIF on Automated Frond End (AFE)
 
Mask Etcher® Gen 2 Gen 3 Gen 4 GenV
Node (nm) 180 130-90 65-45 32-22
Standard Certification:
icon ISO 9001
Application:
icon Typical Applications:
• Cr etch
• Molysilicide etch
• Quartz etch
• NGL: Nano-Imprint and EUV
Specification:
 
 
 
 
 
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