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  Packaging & Testing - Plasma-Therm - RIE / ICP Etcher (Manual Vision Series / ICP / DSE / RIE-Load Lock)



RIE / ICP Etcher (Manual Vision Series / ICP / DSE / RIE-Load Lock)
icon  icon
Main Features:
Plasma Etching or Dry Etching is a plasma based process that facilitates the removal of material from the surface of a substrate. Typically, plasma processing of semiconductor materials is performed in a vacuum environment. The key to dry etching is the creation of reactive species within the plasma that can react with the material on the substrate with the formation of forming volatile reaction byproducts. Dry etching processes are often broken into four mechanisms which must be understood for effective etch system design.
icon Formation of active gas species.
icon Transport of the active species to the surface.
icon Reaction at the surface.
icon Pump down of the reaction products.
Types of Etcher:
icon Versaline Series
Semi-auto / Automatic RIE and ICP:
━RIE with Load Lock.
━ICP with Load Lock or Cassette.
━DSE with Load Lock or Cassette.
Vision Series:
━Manual RIE
Standard Certification:
icon ISO 9001
Application:
icon Plasma-Therm products and technologies serve a broad range of markets, including:
━MEMS/NEMS
━Solid-state lighting
━Wireless
━Photomask
━Nanotechnology
━Renewable energy
━Data storage
━Photonics
━R&D
━Mid-End-of-Line packaging
Specification:
 
 
 
 
 
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