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Applied in UBM/RDL、TSV processes
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| Main Features: |
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1. Advanced transfer system can compatible with 3mm warpage Si/SOG wafer
2. Flexible PM configuration
3. High productivity and low CoO /CoC
4. Excellent film uniformity/target utilization/stress control / particle control / Rc control / ionization rate / step coverage
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| Standard Certification: |
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1. Compatible with 200mm/300mm
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| Application: |
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1. Applicable material: Cu,Ti,Ta, W, TiW, Al, Ni, NiV,…
2. Applicable process: RDL, UBM and through silicon vias (TSV) deposition
3. Applicable field: advanced packaging
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| Specification: |
Company Profile
Packaging & Testing - NAURA - Polaris Series Through Silicon Vias and Wafer Level Package PVD / Sputter
