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  Packaging & Testing - NAURA - Polaris Series Through Silicon Vias and Wafer Level Package PVD / Sputter



Polaris Series Through Silicon Vias and Wafer Level Package PVD / Sputter
Polaris Series Through Silicon Vias and Wafer Level Package PVD / Sputter
Applied in UBM/RDL、TSV processes
Main Features:
icon 1. Advanced transfer system can compatible with 3mm warpage Si/SOG wafer
2. Flexible PM configuration
3. High productivity and low CoO /CoC
4. Excellent film uniformity/target utilization/stress control / particle control / Rc control / ionization rate / step coverage
Standard Certification:
icon 1. Compatible with 200mm/300mm
Application:
icon 1. Applicable material: Cu,Ti,Ta, W, TiW, Al, Ni, NiV,…
2. Applicable process: RDL, UBM and through silicon vias (TSV) deposition
3. Applicable field: advanced packaging
Specification:
 
 
 
 
 
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