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  Packaging & Testing - NAURA - Flexer Series Wafer Level Package PVD / Sputter



Flexer Series Wafer Level Package PVD / Sputter
Flexer Series Wafer Level Package PVD / Sputte
Main Features:
icon Applied in UBM and RDL
Standard Certification:
icon Compatible with 150mm/200mm/300mm
Application:
icon 1. Applicable material: Cu,Ti,Ta, W, TiW, Al, Ni, NiV,…
2. Applicable process: RDL and UBM deposition
3. Applicable field: advanced packaging
Specification:
 
 
 
 
 
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