Scientech Corporation  
  繁中
   
 
 
 
 
   
Product
   
Chemistry and Biotechnology
Broadcast Equipment
Semiconductor III-V Group
arrow2 Auenter
arrow2 ClassOne
arrow2 Dawonsys
arrow2 Eco-Snow
arrow2 Faith
arrow2 FRT
arrow2 IMT
arrow2 Genmark
arrow2 Kensington
arrow2 Kingsemi
arrow2 Kitec
arrow2 KLA-Tencor
arrow2 Kostek
arrow2 MDC
arrow2 MELcon
arrow2 Micro Image
arrow2 Muetec
arrow2 Nanonex
arrow2 NAURA
arrow2 Neutronix Quintel
arrow2 Omron
arrow2 Piotech
arrow2 Plasma-Therm
arrow2 Poongsan
arrow2 Revera
arrow2 Rave
arrow2 Scientech
arrow2 SEMES
arrow2 SiGlaz
arrow2 SMEE
arrow2 Tanehashi
arrow2 Tera
arrow2 TMC
arrow2 TOHO
arrow2 UCP
arrow2 Ulvac
arrow2 Ushio
arrow2 Verity
arrow2 VLSI
arrow2 Zeiss
LCD/ LED/ SOLAR/ DATA STORAGE
MEMS
PCB Industry
Packaging & Testing
Used Tool
Scientech Tool
3D Printer
  Semiconductor III-V Group - SMEE - 500 Series Stepper - IC Back-end Manufacturing



500 Series Stepper - IC Back-end Manufacturing
scientech
Based on the Stepper architecture, the 500 Series Lithography equipments are designed for IC wafer level packaging and MEMS/NEMS manufacturing. The 500 series embed ghi line high power mercury lamp and high-precision/large range Focusing and Leveling Measurement Systems (FLMS) suitable for thin/thick photo-resists and TSV-3D structure. With the advanced pattern-recognition-based alignment system, the equipment eliminates the necessity of specific alignment targets on the wafers. The 500 Series Lithographic equipments with their high-performance, high reliability and low cost-of-ownership (CoO) are ideal and competitive solutions for IC back-end and MEMS manufacturing.
Main Features:
icon 1.Based on a modularized stepper platform with selective process options,supports customer's flexible manufacturing requirements
2.Broadband-mercury-lamp illumination system adapts for various photo-resists(i-line, gh-line, ghi-line)
3.High-irradiance & large size exposure field and hi-speed wafer stage guarantee high throughput
4.Large DOF (depth-of-focus) adapts for ultra-thick photo-resist process
5.High-precision & large capture range automatic focusing system supports both thin and thick resist process
6.Patented smart pattern-recognition alignment system eliminates the needs for dedicated alignment marks
7.Compatible with 200mm and 300mm wafers, easy to exchange automatically
8.Reticle Stage realizes switchover of two exposure positions, which saves half cost of the reticles for the customer
Standard Certification:
icon 1.Resolution 2um
2.Exposure Light Source ghi-line mercury lamp
3.Wafer Size 200mm or 300mm
Application:
icon IC back-end bumping process, including Gold Bump, Solder Bump, Pillar Bump, WLCSP, and RDL etc.
Specification:
 
 
 
 
 
Copyright © 2009 SCIENTECH. All rights reserved. Site map