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Based on the Stepper architecture, the 500 Series Lithography equipments are designed for IC wafer level packaging and MEMS/NEMS manufacturing. The 500 series embed ghi line high power mercury lamp and high-precision/large range Focusing and Leveling Measurement Systems (FLMS) suitable for thin/thick photo-resists and TSV-3D structure. With the advanced pattern-recognition-based alignment system, the equipment eliminates the necessity of specific alignment targets on the wafers. The 500 Series Lithographic equipments with their high-performance, high reliability and low cost-of-ownership (CoO) are ideal and competitive solutions for IC back-end and MEMS manufacturing.
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| Main Features: |
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1.Based on a modularized stepper platform with selective process options,supports customer's flexible manufacturing requirements
2.Broadband-mercury-lamp illumination system adapts for various photo-resists（i-line, gh-line, ghi-line）
3.High-irradiance & large size exposure field and hi-speed wafer stage guarantee high throughput
4.Large DOF (depth-of-focus) adapts for ultra-thick photo-resist process
5.High-precision & large capture range automatic focusing system supports both thin and thick resist process
6.Patented smart pattern-recognition alignment system eliminates the needs for dedicated alignment marks
7.Compatible with 200mm and 300mm wafers, easy to exchange automatically
8.Reticle Stage realizes switchover of two exposure positions, which saves half cost of the reticles for the customer
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| Standard Certification: |
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1.Resolution 2um
2.Exposure Light Source ghi-line mercury lamp
3.Wafer Size 200mm or 300mm
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| Application: |
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IC back-end bumping process, including Gold Bump, Solder Bump, Pillar Bump, WLCSP, and RDL etc.
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| Specification: |
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Semiconductor III-V Group - SMEE - 500 Series Stepper - IC Back-end Manufacturing
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