 |
Measure CD, Overlay, defect, Failure analysis in MEMS,Power Semiconductor, Package |
Main Features: |
 |
1. Easy to operate.
2. High accurate result.
3. Multi function tool.
|
Standard Certification: |
 |
1. Company obtained certificates of ISO
2. Products obtained certificates of SEMI S2
|
Application: |
 |
Measure CD, Overlay, defect, Failure analysis of wafer,
Measure CD, defect inspection.
|
Specification: |
 |
CD Measurement
down to ~0.3µm
optimized algorithms
flexible calibration SW
Overlay Metrology
Overlay repeatabiliy (3σ)
Resist Layer < 2nm
Etched Layer < 4nm
TIS calibrated < 3nm
Film Thickness measurement
1- 3 layers
10nm ... 40µm
Fit & FFT algorithms
|
|