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 Semiconductor III-V Group - ISL TECH Co., Ltd. |
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| Applications |
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Pattern Sapphire Substrate (PSS) |
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LED |
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MEMS |
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GaAs Industry |
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Bumping, Wafer Level Package |
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3D IC (TSV) |
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| Substrates |
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Deep Si Etching |
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GaN and GaAs |
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Sapphire and Quartz |
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SiO2 and SiN |
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ZnO, ITO and Al |
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| Features |
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High Density ICP Source |
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Patented Design of ICP Coil |
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Multi Wafer Processing for 2inch |
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Backside He Cooling |
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| Benefits |
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Good Process Reliability |
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Minimizes Consumable Parts |
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No PR Burning in Room Temp. |
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Company Profile
