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  Semiconductor III-V Group - ClassOne - Electroplating - Production Solstice S4/S8



Electroplating - Production Solstice S4/S8
Electroplating Systems for 75-200mm Substrates
The cost-effective route to volume production for smaller-substrate applications…
If you work on 200mm or smaller substrates you don’t need to buy a big, expensive 300mm plating tool from the Big Guys. Solstice® is a smarter and much more affordable solution.
Main Features:
■ Use for plating, cleaning or etching
■ For 75mm to 200mm substrates
■ Simple diameter change
■ Faster plating rates, higher throughput
■ Superior control, higher uniformity
■ From 2 to 8 process chambers
■ For thin or bonded substrates
■ For transparent or opaque substrates
■ Powerful Windows-based software
■ Broad process flexibility
Standard Certification:
icon Solstice Plating System
Best of West Winner
Semicon West 2015
Application:
■ Cu, Au, Ni, Sn, Ti , alloys and more
■ Cu TSV
■ Cu Pillar
■ Cu Bump
■ Cu RDL and Pad
■ Cu Damascene
■ Wafer Level Packaging
■ Cyanida and non-cyanide Au
■ Low-stress Ni
■ Lead-free solder
Specification:
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