| High speed wafer surface/edge inspection, 100WPH with wafer double side and edge. |
| High speed inspection for: |
Topography: patented phase shift technology |
Reflectivity: synchronous detection enhancement |
Darkfield: proprietary imaging module |
Edge: proprietary sensor design, patent pending |
| Zero edge exclusion (wafer handling by edge) |
| High reliability by design |
| Vertical wafer holder for low stress and particle reduction |
| Defects images recorded on the fly for offline review |
| Upgradable to 450 mm |